ATS-21C-81-C3-R0

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A thermal - heat sink is an electronic device or component that is designed to dissipate the heat generated from other electronic components by absorbing or dissipating the heat radiation. Generally, they are used in hardware and networking devices, such as servers, graphics cards, power supplies, and other electronic components. The ATS-21C-81-C3-R0 is one such thermal - heat sink.

The ATS-21C-81-C3-R0 is a light weight aluminum device specifically designed to manage the heat radiation from electronic components. It is called a light weight thermal - heat sink because it is made from aluminum, which is known to be a good conductor of heat.

The ATS-21C-81-C3-R0 uses a combination of conduction and convection to dissipate the heat. In order to achieve the optimal heat dissipation, the device has a large array of small fins and channels which helps to move the hot air away from the electronics. The fins and channels effectively increase the surface area of the device which helps to increase the air circulation for better cooling and faster heat dissipation.

The ATS-21C-81-C3-R0 is designed to work in a variety of applications including server, storage, and telecommunications systems. It is also suitable for industrial applications, including industrial electrical and power supply systems. In these applications, it is important to have a reliable thermal heat sink to ensure efficient cooling of the components. This thermal - heat sink also reduces the noise level from fans and other sources.

The ATS-21C-81-C3-R0 can be used in applications with a wide range of operating temperatures, including from -40°C to + 315°C. The device also features a quick-disconnect, easy-to-install design which allows it to be mounted on the most common types of electronic components and equipment, such as microprocessors, memory chips, power supplies, and LEDs.

At the core of the ATS-21C-81-C3-R0’s design is its efficient thermal conductivity. This allows the heat to be conducted away from the components quickly and efficiently, thus a better performance in the application field. The device also features a construction of aluminium alloy construction which has excellent thermal conductivity, making it ideal for heat dissipation from places such as server and power supply racks.

The ATS-21C-81-C3-R0 also has high heat dissipation performance and is suitable for most applications that require reliable thermal management. It is able to dissipate up to 300 W of power loss which is perfect for applications such as servers, workstations, and other industrial applications.

In summary, the ATS-21C-81-C3-R0 is a light weight thermal – heat sink designed for thermal management applications in the server, storage, instrumentation, power and telecommunications applications. It is designed to dissipate the heat of processors, memory chips, power supplies and LEDs to less than or equal to 300 W of power loss. It features a design of aluminum alloy construction which allows for high heat dissipation rates and excellent thermal conductivity. It is also designed for applications over a wide range of operating temperatures and includes a quick-disconnect design.

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