Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.79°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-21D-100-C3-R0 Application Field and Working Principle

Introduction

Heat sinks are commonly used in many electronic devices and systems and the ATS-21D-100-C3-R0 is one such device. The ATS-21D-100-C3-R0 is a thermal - heat sink that is used to prevent damage to electronic components by dissipating heat from the component. In this article, we will discuss the application fields and working principle of the ATS-21D-100-C3-R0.

Application Fields

The ATS-21D-100-C3-R0 is specifically designed to be used in high performance electronic devices and systems. It is designed to provide efficient and reliable heat dissipation and is well suited for applications such as automotive electronics, computers, consumer electronics, and industrial control systems. As a thermal - heat sink, it is particularly suitable for use in high power electronics that generate large amounts of heat, and is also capable of handling high frequency currents.The ATS-21D-100-C3-R0 is built from aluminum alloy, making it a lightweight yet rugged solution. It has a highly optimized heat transfer coefficient and is able to dissipate heat from the component quickly and efficiently. Moreover, it is designed with an air flow separator to prevent air from flowing back onto the component, thus preventing it from getting too hot.

Working Principle

The ATS-21D-100-C3-R0 works by using the principle of thermodynamics. Heat is generated in an electronic component, and this heat is transferred to the ATS-21D-100-C3-R0. The device then dissipates the heat by transferring it to the surrounding air through conduction, convection, and radiation. Conduction is the transfer of heat through direct contact while convection is the transfer of heat through the air.The ATS-21D-100-C3-R0 is designed to provide efficient heat dissipation and reduce the temperature of the component. It uses a combination of fin geometry and material composition to maximize the surface area and maximize the heat transfer rate. The device is also designed with cooling channels that help to spread the heat out over a larger area and reduce the temperature spikes on the component.

Conclusion

In conclusion, the ATS-21D-100-C3-R0 is a thermal - heat sink designed for use in high performance electronic components and systems. It is built from aluminum alloy to provide optimal heat transfer while also being lightweight and rugged. The device is designed with air channels and cooling channels to maximize the surface area and reduce the temperature of the component. It works by using the principle of thermodynamics and is capable of dissipating heat quickly and efficiently.

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