ATS-21D-130-C3-R0

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Thermal management systems are essential for today’s applications, and ATS-21D-130-C3-R0 thermal - heat sinks represent the latest in thermal management technology.

The ATS-21D-130-C3-R0 thermal - heat sink is designed for use with devices where the thermal load and component temperature requirements need to be managed effectively. It is designed for use in numerous applications such as, but not limited to, LED lighting, semiconductor electronics, telecommunications, and instrumentation.

The ATS-21D-130-C3-R0 is also ideal for use in thermally intensive applications, such as radar and high power electronics, where the component temperature requirements must be managed strictly. With its superior thermal conductivity, high performance capabilities, and extensive range of features, it is ideal for applications with extended operational lifetime requirements.

The ATS-21D-130-C3-R0 provides optimum thermal management and cooling solutions by utilizing a combination of aluminum alloy fins and copper heatpipe technologies. It’s advanced cooling system ensures that heat is effectively and efficiently dissipated so that component temperatures remain within specified limits.

The ATS-21D-130-C3-R0 is also designed for cost-effectiveness and high reliability. It features an advanced heatpipe cooling module, which significantly reduces overall system costs. It is highly efficient in its cooling performance without any risk of short-circuiting or other thermal problems. Moreover, its high-efficiency performance ensures extended product life.

The ATS-21D-130-C3-R0 also offers an impressively low thermal resistance, making it a viable choice for applications that require superior thermal transfer capabilities. Its thermal resistance is approximately one-tenth of traditional passive heat sink solutions, and guarantees that highest levels of thermal performance can be achieved. Additionally, it is designed to provide superior heat dissipation in an incredibly small form factor, ensuring that it can be mounted and integrated into any application.

In terms of working principles, the ATS-21D-130-C3-R0 works by effectively pairing two components – a heat dissipation fin array and a heat pipe – to dissipate the maximum amount of heat generated. The heat pipe plays a crucial role by transferring the heat created by the device to the larger finned heat dissipation surfaces, where the heat can be more easily dispersed into the air. The fin array is key for improving the airflow around the device and helping to conduct the heat away from it.

To ensure maximum performance, the ATS-21D-130-C3-R0 utilizes a combination of physical design characteristics such as a highly efficient copper-alloy construction and a robust heatpipe assembly. The copper alloy fins provide superior heat conduction properties, ensuring that the heat produced by the device is quickly and efficiently dissipated. The heatpipe assembly is responsible for ensuring that the heat is effectively transported away from the device to the fins.

The ATS-21D-130-C3-R0 also utilizes a unique design for optimal space utilization, allowing for maximum airflow to reduce thermal resistance and improve cooling performance. A unique heatpipe design allows for the heat to be quickly transferred away from the device, resulting in superior heat dissipation.

In summary, the ATS-21D-130-C3-R0 thermal - heat sink is an essential component for the thermal management of many applications requiring reliable, efficient cooling. Its superior thermal performance, high reliability, and cost-effectiveness make it a top choice for those looking to achieve optimal thermal management.

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