| Allicdata Part #: | ATS-21D-137-C3-R0-ND |
| Manufacturer Part#: |
ATS-21D-137-C3-R0 |
| Price: | $ 3.20 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21D-137-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.91249 |
| 30 +: | $ 2.83395 |
| 50 +: | $ 2.67649 |
| 100 +: | $ 2.51899 |
| 250 +: | $ 2.36157 |
| 500 +: | $ 2.28284 |
| 1000 +: | $ 2.04668 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.63°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential to the proper functioning of electronic components, and heat sinks play an important role in reducing temperatures. Heat sinks are commonly used in the electronics industry as they are typically inexpensive, can be manufactured in various sizes, and can be easily integrated into existing systems. One popular type of heat sink is the ATS-21D-137-C3-R0.
The ATS-21D-137-C3-R0 is a compact, lightweight, aluminum heat sink with a copper base. It measures approximately 137 mm x 137 mm/125 mm x 25 mm, and is suitable for various applications and operating temperatures, including those in a range of -40 ℃ to + 150 ℃.
The ATS-21D-137-C3-R0 heat sink is designed for efficient heat dissipation while providing reliable thermal insulation. It has a highly efficient thermal design with a low profile, and a low thermal resistance to ensure efficient heat transfer. This heat sink is constructed with an aluminium fin stack, and a copper base for optimal performance. Its unique layout includes cross-sectional cooling slots that enhance the cooling process and allow more wind to pass through the heat sink. Additionally, its patented fin-ridge design ensures the efficient transfer of heat.
The ATS-21D-137-C3-R0 is designed to work in applications requiring efficient heat dissipation, such as those related to processors, high frequency converters, and LED light sources. It is also suitable for use in other applications where thermal control is critical, including medical equipment, audio equipment, and power supplies. In these applications, the ATS-21D-137-C3-R0 is capable of dissipating heat and maintaining optimal operating temperatures.
The working principle of the ATS-21D-137-C3-R0 is very simple. Heat is generated by electronic components inside the system, and this heat is transferred to the ATS-21D-137-C3-R0 via metal heat pipes, which are connected to the copper base or fin stack. The heat is then dissipated from the heat sink by convection and absorbed by the surrounding air. This process reduces the temperature of the electronic components and ensures their optimal performance.
The ATS-21D-137-C3-R0 is an efficient, lightweight, and cost effective aluminum heat sink that is suitable for a wide range of thermal management applications. Its highly efficient design and low thermal resistance make it an ideal choice for cooling electronics, and its patent-pending fin-ridge design ensures efficient heat dissipation. Heat is efficiently dissipated to the surrounding air, enabling the optimal performance of various electronic components.
The specific data is subject to PDF, and the above content is for reference