| Allicdata Part #: | ATS-21D-139-C3-R0-ND |
| Manufacturer Part#: |
ATS-21D-139-C3-R0 |
| Price: | $ 3.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21D-139-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.03156 |
| 30 +: | $ 2.94945 |
| 50 +: | $ 2.78573 |
| 100 +: | $ 2.62181 |
| 250 +: | $ 2.45796 |
| 500 +: | $ 2.37602 |
| 1000 +: | $ 2.13022 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical component of all modern electronic systems. As electronic components generate heat due to power dissipated through their circuits, it’s important to maintain the necessary temperature for the system to work without compromising its performance or reliability. Heat sinks and other thermal management devices help to regulate the temperature in an electronic system by absorbing and dissipating the excess heat.
The ATS-21D-139-C3-R0 is a passive heat sink designed to effectively control the temperature in electronic systems. It utilizes a combination of heat dissipation and convection to regulate and control the temperature. The ATS-21D-139-C3-R0 is designed to dissipate heat away and keep temperatures in controlled environments within ±5°C of the specified temperature setpoint.
This heat sink’s compact design allows for easy integration and flexible installation. Its superior thermal performance ensures optimal heat dissipation and it also offers excellent air circulation for improved airflow. The ATS-21D-139-C3-R0 is capable of efficiently operating temperatures up to 140°C. It also has a patented clip locking mechanism for easy installation and removal.
The ATS-21D-139-C3-R0 is designed to meet the thermal management needs of high-performance electronic systems. It is ideal for applications such as power supplies, communications systems, automotive electronics, medical equipment, industrial automation and embedded systems. The heat sink is also suitable for use in high-reliability and industrial-grade environments.
The ATS-21D-139-C3-R0 provides an optimal thermal solution for a wide range of applications and is suitable for use in harsh operating conditions. It is designed to provide long-term stability and reliable performance, while also helping to reduce the overall temperature in an electronic system. With its robust design, the ATS-21D-139-C3-R0 is a reliable and cost-effective thermal solution for applications where long-term performance is critical.
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