ATS-21D-140-C3-R0

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Thermal cooling solutions are essential for the delivery of high-powered electronic systems and critical components. Heat sinks are the most commonly used components for heat transfer systems in electronic devices and are designed to take excess heat from sensitive components and disperse it to the surrounding environment for dissipating it. The ATS-21D-140-C3-R0 is an advanced heat sink component that have been designed for high-power applications. This article discusses the application field and working principle of the ATS-21D-140-C3-R0.

The ATS-21D-140-C3-R0 is a passively cooled aluminum heat sink with a shallow wave design. It is built with a solid aluminum base and finned with a series of fins, which increases the surface area available for heat transfer. The ATS-21D-140-C3-R0 provides optimal thermal performance with its passive cooling system, and is ideal for use in applications where a reliable and efficient solution for cooling is required. It is particularly suited for cooling high-performance and critical components, such as processors, GPUs, memory, and voltage regulators, which require effective heat dissipation.

In terms of applications, the ATS-21D-140-C3-R0 can be used for a variety of intensive computing tasks such as server hosting, gaming, scientific computing, and other intensive CPU operations. These applications are designed to demand a significant amount of power from the system, and the high-efficiency heat transfer provided by the ATS-21D-140-C3-R0 allows them to perform to their full capacity without the risk of overheating. The component is also suitable for applications where vibration or shock is present, as the shallow wave design ensures that the system remains stable even under extreme conditions.

The working principle of the ATS-21D-140-C3-R0 is relatively straightforward. Heat is absorbed by the aluminum base through contact with the device to be cooled. The order of magnitude of the heat absorbed by the aluminum base is dependent on the thermal resistance of the material used. The fins on the ATS-21D-140-C3-R0 then dissipate the heat to the surroundings by convection, ensuring that the system stays cool. The aluminum used in the construction of the heat sink also provides excellent thermal conductivity, which allows the heat to transfer quickly and efficiently to the surroundings. This ensures that the device remains cool even when put under demanding conditions.

The ATS-21D-140-C3-R0 is an effective and reliable cooling solution for high-powered electronics and components. Its shallow wave design ensures that the system remains stable and efficient even under extreme conditions, while its aluminum construction allows for efficient heat transfer. This makes it ideal for applications where a reliable and efficient cooling solution is required, such as when cooling high-performance and critical components.

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