ATS-21D-16-C1-R0

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Thermal – Heat Sinks are a crucial component in many electronic devices, and can have a crucial impact on product performance, quality, and reliability. ATS-21D-16-C1-R0 is an example of a thermal-heat sink that is used in many applications such as personal computers, small devices, and larger consumer electronics products. This article will explore the characteristics, applications, and working principles of the ATS-21D-16-C1-R0.

Characteristics of ATS-21D-16-C1-R0

The ATS-21D-16-C1-R0 is a high-performance, ultra-slim aluminum heat sink designed for applications where size and weight are at a premium. The heat sink is constructed of a single-piece extrusion of 6063 aluminum alloy and features an integrated aluminum spreader for maximum thermal performance. The cooler has an overall dimension of 155.4mm length x 28.4mm width x 12.8mm height, with a weight of only 58.0g.

The ATS-21D-16-C1-R0 uses a combination of advanced extrusion technology and high-grade thermal-conductive materials to create a heat sink with superior thermal performance. In addition, the cooler is designed with optimized fin pitch and thickness, as well as a unique air pathway that guides air flow through the heatsink for maximum efficiency. Furthermore, the ATS-21D-16-C1-R0 features an innovative solid-fin spreader design that focuses and spreads thermal energy throughout the heatsink for superior heat dissipation.

Applications for ATS-21D-16-C1-R0

The ATS-21D-16-C1-R0 is primarily used in applications where size and weight are at a premium, and where superior thermal performance is required. This makes it ideal for use in personal electronic devices such as smartphones, tablets, and thin laptops. The cooler is also suitable for larger consumer electronics products such as game consoles and set-top boxes, as well as industrial and medical applications. Additionally, the ATS-21D-16-C1-R0 can be used in LED lighting products and embedded systems.

Working Principle of ATS-21D-16-C1-R0

The cooling system of the ATS-21D-16-C1-R0 utilizes a combination of heat conduction and natural convection. Heat is transferred from the hot surface (e.g. microchip, processor, etc.) to the heatsink by conduction; the thermal-conductive material in the heat spreader ensures maximum heat transfer between the hot surface and the heatsink. The heatsink then dissipates the heat through natural convection, as hot air is drawn away from the heatsink by cooled air.

The ATS-21D-16-C1-R0 is designed to optimize cooling performance and make the most efficient use possible of the limited space available for air circulation. The optimized fin pitch and thickness, as well as the unique air pathway, ensures that the heated air is dispersed quickly and efficiently away from the heatsink. Furthermore, the solid-fin spreader design ensures that the thermal energy is efficiently and evenly spread throughout the heatsink for maximum cooling performance.

Conclusion

The ATS-21D-16-C1-R0 is an example of a highly efficient thermal-heat sink that is designed for use in applications where space and weight are at a premium. The cooler combines advanced extrusion technology with high-grade thermal-conductive materials to create a heat sink that is both lightweight and highly effective. The ATS-21D-16-C1-R0 is primarily used in personal electronic devices as well as larger consumer electronics such as game consoles and set-top boxes, LED lighting products, and embedded systems. The cooler utilizes a combination of heat conduction and natural convection to dissipate heat in the most efficient manner possible, making it the perfect solution for any application where thermal performance is a priority.

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