| Allicdata Part #: | ATS-21D-165-C3-R0-ND |
| Manufacturer Part#: |
ATS-21D-165-C3-R0 |
| Price: | $ 3.20 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21D-165-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.91249 |
| 30 +: | $ 2.83395 |
| 50 +: | $ 2.67649 |
| 100 +: | $ 2.51899 |
| 250 +: | $ 2.36157 |
| 500 +: | $ 2.28284 |
| 1000 +: | $ 2.04668 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.63°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks, ATS-21D-165-C3-R0, refers to a type of passive cooling device that is used to cool electrical components, or other hot systems such as thermal management in an environment with limited or absent cooling. Heat sinks are widely used in computer processors, current transformers, and other electronic components.
The ATS-21D-165-C3-R0 lead free heat sink is made of aluminum and has an integral mounting clip. The copper-alloy base provides maximum heat transfer whilst the extruded aluminum fin structure increases its surface area. This heat sink also incorporates adjustable mounting brackets which allow for larger components to be fitted as well as different orientations. The overall dimensions of the ATS-21D-165-C3-R0 heat sink are 165 x 91 x 34mm.
The ATS-21D-165-C3-R0 thermal management application field is mainly used in microprocessor core applications. It can provide a stable thermal working temperature for the microprocessor even when it operates under the following decelerating load conditions: high frequency, over-clocking, and high temperature environments. Some practical applications of the ATS-21D-165-C3-R0 include in server systems, computer gaming systems, and industrial control.
This thermal management application combines the efficient performance of a heat sink with the cost-effectiveness of a fanless solution, eliminating the need for an additional cooling device. The heat sink dissipates the heat from the microprocessor to the surrounding environment, thereby providing a reliable and efficient cooling solution. The device also features an adjustable fan speed control system, which enables it to adapt to different load conditions, allowing it to maintain a stable working temperature.
The working principle of ATS-21D-165-C3-R0 is based on a thermoelectric effect, also known as Joule heating. In this effect, an electric current is passed through a conductor to generate heat. This heat is then dissipated to the ambient environment via a fan or other cooling mechanism. The ATS-21D-165-C3-R0 heat sink utilizes this Joule heating effect to dissipate heat away from the microprocessor, thus achieving thermal management.
To conclude, the ATS-21D-165-C3-R0 heat sink is an effective thermal management device that is designed for use in microprocessor core applications. It utilizes thermoelectric properties to efficiently dissipate heat away from the microprocessor, without the need for an additional cooling device. The device also incorporates adjustable mounting brackets and fan speed control which enable it to adapt to different load conditions. It is an ideal thermal solution for server systems, computer gaming systems, and industrial control applications.
The specific data is subject to PDF, and the above content is for reference