| Allicdata Part #: | ATS-21D-167-C1-R0-ND |
| Manufacturer Part#: |
ATS-21D-167-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21D-167-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-21D-167-C1-R0 is a thermal-heatsink, designed for use in a wide variety of applications. It is an integral part of the cooling system in many electronic devices. Designed for use in demanding industries such as telecommunications, automotive and energy production, this thermal-heatsink optimizes the cooling of sensitive electronics safely and efficiently.The design of the ATS-21D-167-C1-R0 consists of an aluminum base with an inverted U-shaped to provide enhanced heat transfer and greater stability. The base is connected to the heat-pipe which is responsible for the heat-dissipation from the device being cooled. The top of the heat-pipe has a finned heat sink which has an increased surface area for better heat-dissipation. The heat-pipe is filled with a thermally conductive fluid which helps to convey the heat from the device to the heat-sink efficiently. The ATS-21D-167-C1-R0 offers improved thermal performance, resulting in a prolonged life of highly sensitive electronics and components. The thermal-heatsink greatly reduces the temperature of components and the device itself by efficiently dissipating the heat away. This effectively prevents thermal damage to the components as well as reduces the frequency of overheating. Additionally, the thermal-heatsink optimizes the cooling system of the device, allowing for improved performance. The ATS-21D-167-C1-R0 can be easily installed into any device, no matter the size or shape. The provided mounting brackets allow for secure and simple installation. The thermal-heatsink can be installed in either horizontal or vertical directions, depending on the requirements of the device.Due to its superior heat-dissipation and adjustable installation capabilities, the ATS-21D-167-C1-R0 is the ideal thermal-heatsink solution for any device in need of efficient cooling. Its impressive performance makes it the perfect choice for applications such as telecommunications, automotive and energy production. With the ATS-21D-167-C1-R0, you can be sure that your device is operating at its best with maximum efficiency.
The specific data is subject to PDF, and the above content is for reference