| Allicdata Part #: | ATS-21D-187-C1-R0-ND |
| Manufacturer Part#: |
ATS-21D-187-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21D-187-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are used to efficiently transfer thermal energy from an electronic component or circuit to the ambient environment. As heat sinks are designed to offer the highest level of heat dissipation, it is important to ensure the right model is selected, specifically in terms of thermal performance and aesthetics. The ATS- 21D- 187- C1- R0 is one such reliable heat sink model used to cool electronic components.
The ATS- 21D- 187- C1- R0 heat sink is a type of extruded heat sink, typically made of aluminum. It is designed with an integrated fin technology that provides superior thermal performance with low airflow resistance and low weight. This model is manufactured for the 95x95mm mounting dimension, which makes it compatible with most electronic components. It typically features a wide base, a heat sink fan, and a cylindrical shape focus, allowing the heat sink to concentrate a large area of thermal force.
The design of the ATS- 21D- 187-C1-R0 heat sink is optimized for cooling power electronics components, such as power grid components, panel box controllers, DC-DC converters, power supplies, current regulators, power modules, and IGBTs. It can also be used to cool CPUs in computers, electronic simulators, and other electronic components. Its thermal performance is optimized with a fin spacing of 0.3mm, which helps to maximize air flow and maximizes thermal conductivity. The fin pile also helps to reduce noise levels, ensuring quieter operation.
The working principle of the ATS- 21D- 187- C1- R0 heat sink is based on the convective cooling process. This process works by creating a temperature difference between the surface of the heat sink and the surrounding air, which causes a drop in air temperature around the heat sink. This, in turn, causes air to circulate around the heat sink, helping to dissipate heat. The shape of the ATS- 21D- 187- C1- R0 heat sink helps create an optimal air flow circuit around the heat sink, allowing more efficient heat dispersal.
The ATS- 21D- 187- C1- R0 is an efficient and reliable heat sink solution for those needing powerful cooling solutions. It is designed to provide superior thermal performance, low noise levels, and optimal air flow. Its compact size allows it to fit into tight spaces without compromising performance, making it an ideal choice for those needing reliable heat sinks that can handle demanding requirements.
The specific data is subject to PDF, and the above content is for reference