| Allicdata Part #: | ATS-21D-188-C3-R0-ND |
| Manufacturer Part#: |
ATS-21D-188-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21D-188-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.75°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-21D-188-C3-R0 is a thermal-heat sink component used in electronic device cooling systems. It is designed to maintain temperatures within a specific operating envelope, ensuring that the device remains safe and functioning optimally over the long term. The ATS-21D-188-C3-R0 is composed of a heat sink base in conjunction with a fan assembly. It is suitable for various applications, including PCs, TVs, digital cameras, video game consoles, and other electronic devices.
Heat sinks are devices used to manage thermal energy dispersion from electronic components. The thermodynamic and mechanical screening of heat generated by electronic components and devices is an essential part of the design process during manufacture and assembly. Heat sinks help to extend the life of electronic components and devices by helping them dissipate heat safely, preventing them from becoming damaged or destroyed.
The ATS-21D-188-C3-R0 is designed to be a reliable, cost-effective heat sink device. The base of the ATS-21D-188-C3-R0 is manufactured from alloys of aluminum and steel, providing a durable and highly efficient heat conduction media. The base is then micro-etched to create a series of uniformly-sized heat dissipation fins that further enhance heat transfer. The fan assembly is designed to maximize cooling efficiency and the flow of air through the fins. The fan is constructed from durable, expanded foam-filled plastic, and it is housed in an adjustable mounting bracket for easy installation.
The ATS-21D-188-C3-R0\'s primary application is in the cooling system of electronic devices and components. This versatile component is designed to work in ambient temperatures from -20°C to +55°C and can accommodate air flow rates of up to 75cfm. The ATS-21D-188-C3-R0 is also designed to work with 16-bit computers, 32-bit platforms, and various CPU-based systems, allowing it to meet the needs of virtually any electronic device.
The working principle of the ATS-21D-188-C3-R0 is fairly simple. It uses a heat sink base in conjunction with a fan assembly to draw heat away from the source and dissipate it into the surrounding air. The air flows over the heat dissipating fins, causing them to absorb and dissipate the heat. The fan assembly forces air over the fins, speeding up the process. This allows for more efficient cooling and prevents the electronic components from overheating and damaging the device.
In conclusion, the ATS-21D-188-C3-R0 is a versatile thermal-heat sink component designed to maintain optimal operation of electronic components and devices in a wide variety of applications. It is easy to install, reliable, and cost-effective. Its working principle is simple yet effective, allowing it to efficiently dissipate heat and keep electronic components cool. This reliable and long-lasting component is an essential part of any electronic device’s cooling system, ensuring that it remains functional and safe for many years to come.
The specific data is subject to PDF, and the above content is for reference