| Allicdata Part #: | ATS-21D-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-21D-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21D-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are designed to dissipate the heat generated by electronic components into the surrounding environment. The ATS-21D-20-C3-R0 Heat Sink is a compact heatsink designed to provide efficient thermal management of electronic devices with a wide range of power levels and thermal dissipations.
Application Field of ATS-21D-20-C3-R0
The ATS-21D-20-C3-R0 Heat Sink is designed for use with various electronic devices. It is most commonly used with power-dissipating components such as processors, integrated circuits, transistors, and other power devices. Due to its compact size, the ATS-21D-20-C3-R0 can also be used in areas with limited space. Additionally, its mounting holes make it suitable for many custom applications.
Working Principle of ATS-21D-20-C3-R0
The ATS-21D-20-C3-R0 Heat Sink is designed to dissipate heat generated by the electronic device into the surrounding environment. The working principle of this heatsink revolves around the use of extended surface area. By increasing the surface area of the heatsink, the rate of heat dissipation will be increased as well.
The resulting thermal conduction process utilizes the air from the surrounding environment to transfer heat away from the device. This is done via natural convection, where the heated air will rise away from the device due to the natural laws of physics. The combination of these two thermal dissipation processes allows for effective heat management of the electronic device.
Conclusion
The ATS-21D-20-C3-R0Heat Sink is a compact heatsink that is designed to provide effective thermal management for power-dissipating components such as processors, integrated circuits, transistors, and other power devices. It is designed using extended surface area for increased thermal conductivity and utilizes natural convection to dissipate heat away from the device. It is suitable for limited space applications due to its compact design and is easy to install due to its mounting holes.
The specific data is subject to PDF, and the above content is for reference