| Allicdata Part #: | ATS-21D-38-C3-R0-ND |
| Manufacturer Part#: |
ATS-21D-38-C3-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X22.86MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21D-38-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal managent is a critical component of nearly all electronic devices and power systems. Keeping components cool is a major part of keeping them working at their best and avoiding possible damage due to overheating. Thermal heat sinks are a key element in this process, as they transfer heat away from the source and help dissipate it. The ATS-21D-38-C3-R0 is a great example of a thermal heat sink that has a variety of applications in electronic devices and power systems.
The ATS-21D-38-C3-R0 is a compact and efficient thermal heat sink composed of high-performance heat transfer materials such as copper, aluminum, and thermoplastics. It is designed and optimized to dissipate large amounts of heat away from sensitive components quickly and effectively. Its light weight and low profile make it ideal for use in space-constrained applications, while its wide operating temperature range makes it suitable for a wide range of applications.
The working principle behind the ATS-21D-38-C3-R0 is simple. It works by transferring the heat from the source to the heat sink globally via convection. This allows the heat to be dissipated over a large surface area, spreading the heat load over multiple channels and in turn reducing the temperature of the components. The ATS-21D-38-C3-R0 also uses a unique pin hole pattern that promotes increased air circulation and enhances the convection process.
The ATS-21D-38-C3-R0 thermal heat sink is widely applicable for thermal management of electronic devices and power systems. It is most commonly used in computer and data communication equipment, telecommunications systems, and industrial electronics. It is well-suited for harsh environments due to its excellent thermal conductivity and superior construction materials. In addition, its wide temperature range and thin design also make it ideal for use in medical systems, high-end audio and video equipment, and even automotive electronics.
In summary, the ATS-21D-38-C3-R0 thermal heat sink is an effective and reliable thermal management solution that is applicable for a wide range of high-power and sensitive electronic applications. Its simple and efficient design makes it perfect for use in tight spaces, and its high-quality construction materials ensure that it will continue to perform well in harsh environments. Through efficient convection and the unique pin hole pattern, the ATS-21D-38-C3-R0 helps to protect sensitive components by quickly and effectively transferring heat away from them and into the air. With its wide range of applications and reliable construction, it is no wonder why the ATS-21D-38-C3-R0 is becoming a popular choice among thermal management professionals and electronic device engineers.
The specific data is subject to PDF, and the above content is for reference