| Allicdata Part #: | ATS-21E-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-21E-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21E-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Introduction
Heat sinks are a widely used type of heat transfer equipment which use thermally conductive materials, usually metals, in order to dissipate heat from an object. Heat sinks, in most cases, are used to maintain the temperature of hardware components at an rate normal level.
The application of a heat sink is to dissipate heat from a source, usually objects that generate heat in order to preserve the component and extend its life.
One common example is a computer’s processor processor. The processor can be extremely hot after an extended period of time, so a heat sink is usually placed on the processor to dissipate the heat when it gets too hot.
ATS-21E-10-C1-R0
The ATS-21E-10-C1-R0 is a heat sink designed for use in thermal management applications in the industrial and semi-conductor industries.
It is designed to handle large quantities of heat output, and can dissipate approximately 23 watts of thermal energy per square centimeter. This makes it suitable for applications that need to dissipate large amounts of thermal energy, such as in high-performance capacitors and high-powered transistors.
The ATS-21E-10-C1-R0 is machined out of aluminum for better thermal conductivity and it comes with a variety of mounting options. Anodized aluminum is used for corrosion protection.
Application Field and Working Principle
The ATS-21E-10-C1-R0 has many applications in a wide range of industries. It is usually used in industrial or semi-conductor applications where a large amount of thermal energy needs to be dissipated quickly and efficiently.
The heat sink works by transferring heat away from the source, usually through conduction. Heat is dissipated through the heat sink by convection or radiation, usually out of the aluminum fins.
The ATS-21E-10-C1-R0 can be installed on a device or component by means of screws, bolts, or other special mounting hardware.
Benefits
The ATS-21E-10-C1-R0 provides many benefits for industrial or semi-conductor applications. It is designed to dissipate large amounts of heat without the need for additional cooling equipment.
It is also designed to dissipate the heat quickly, reducing the risk of component failure or damage. By reducing the amount of heat in the enclosure, it also helps to reduce power consumption and extend component life.
The ATS-21E-10-C1-R0 can also be customized according to the needs of a specific application. It can be customized to different sizes, shapes, and colors in order to fit into the space that it is needed for.
The specific data is subject to PDF, and the above content is for reference