ATS-21E-10-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-21E-10-C3-R0-ND

Manufacturer Part#:

ATS-21E-10-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21E-10-C3-R0 datasheetATS-21E-10-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are widely applied in a diversity of devices, from computers and consumer electronics, to industrial machinery. The ATS-21E-10-C3-R0 is specifically designed for use in thermal applications such as electronics cooling and computer heat sinks. It is an exceptionally reliable heat sink made of high-grade aluminum alloy that provides excellent thermal transfer characteristics.

The ATS-21E-10-C3-R0 consists of a central block of aluminum material with a highly efficient fin pattern of various sizes. The fins are configured in a way to maximize surface area and thereby create more efficient thermal contact between the air and the block material. The aluminum block also contains a series of radiating fins that further increase the rate of air-to-block heat transfer.

The ATS-21E-10-C3-R0 is specially designed to move heat away from the point of generation and direct it away from the component or system. When mounted in a convenient orientation, the convective flow of air creates a low pressure area to draw hot air away from the component or system, transferring the heat to the surrounding environment.

The ATS-21E-10-C3-R0 offers several advantages for thermal applications. As a passive device, it doesn\'t require any electrical power at all and is therefore extremely efficient. The aluminum alloy construction also ensures that thermal conduction is optimal, resulting in higher efficiency and greater cooling.

Furthermore, the ATS-21E-10-C3-R0 is fast and easy to install and it can easily be adjusted to fit in a variety of applications. It can be used in both single and multiple fan configurations to provide more efficient cooling, and it is also available in a wide range of sizes and fin configurations.

In conclusion, the ATS-21E-10-C3-R0 is an excellent solution for thermal applications such as electronics cooling and computer heat sinks. Its high-grade aluminum alloy construction ensures optimal thermal conduction and its adjustable fin configuration offers easy installation and maximum efficiency.

The specific data is subject to PDF, and the above content is for reference

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