| Allicdata Part #: | ATS-21E-116-C3-R0-ND |
| Manufacturer Part#: |
ATS-21E-116-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21E-116-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The thermal heat sinks are generally used to dissipate the heat generated by electrical and electronic components, usually in the form of a heat sink. The ATS-21E-116-C3-R0 heat sink is one such product that is designed to provide thermal management solutions for a wide variety of applications.
The ATS-21E-116-C3-R0 heat sink offers a robust and efficient way to manage and dissipate heat from all types of semiconductors, microprocessors, displays, and electronic circuits. The heat sink features a cooling fan that is able to quickly cool down components by drawing the hot air away from them and forcing cool air over them instead. This ensures that the component is not subjected to continuous and prolonged exposure to high temperatures, which may cause it to overheat and eventually fail.
The ATS-21E-116-C3-R0 heat sink also has a heatsink attachment system that securely attaches the heatsink to the component. This ensures that the heatsink remains firmly attached to the component, allowing it to dissipate heat evenly and quickly, much more efficiently than if the heatsink was not attached. As the heatsink is in direct contact with the component, this also ensures that the heat is not excessively radiated to any other electronic components that may be nearby.
The ATS-21E-116-C3-R0 heat sink works on the principle of conduction. This involves the heat generated by the component being conducted away by a conducting material such as copper or aluminum, or a combination of both. This material is typically mounted to a mounting plate, which is then bolted onto the component to ensure maximum contact between the component and the heat sink. The material then collects the heat from the component and transfers it away from the component, dissipating it into the surrounding environment.
The ATS-21E-116-C3-R0 thermal heat sink is designed for use in many different types of applications, including industrial, automotive, consumer electronics, and even medical applications. It is an easy to install and use product with a low profile that enables it to be fitted into any existing case design. The heat sink has a high performance rating and is capable of providing significant cooling capabilities for various components. It is also highly reliable and is designed to provide long-lasting durability, allowing it to withstand the demands of even the toughest applications.
In conclusion, the ATS-21E-116-C3-R0 thermal heat sink is an excellent choice for a wide variety of applications that require efficient and reliable thermal management solutions. The heat sink offers a robust and reliable method of dissipating heat from components. It features an effective heatsink attachment system, as well as a high-performance cooling fan. Furthermore, it is an easy to install and use product that provides long-lasting durability. All of these features make the ATS-21E-116-C3-R0 thermal heat sink an ideal choice for a variety of applications.
The specific data is subject to PDF, and the above content is for reference