![ATS-21E-117-C1-R0 Allicdata Electronics](https://files.allicdata.com/upload/common/default.jpg)
Allicdata Part #: | ATS-21E-117-C1-R0-ND |
Manufacturer Part#: |
ATS-21E-117-C1-R0 |
Price: | $ 3.09 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X10MM XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 2.78208 |
30 +: | $ 2.70669 |
50 +: | $ 2.55629 |
100 +: | $ 2.40591 |
250 +: | $ 2.25553 |
500 +: | $ 2.18034 |
1000 +: | $ 1.95479 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a major issue for modern electronics. As electronic components continue to become smaller and systems become more complex, thermal conditions within a device can have profound effects on the device\'s performance and reliability. The ATS-21E-117-C1-R0 is a thermal heat sink designed to provide uniform heat distribution in highly complex systems.
The ATS-21E-117-C1-R0 is a type of heat sink designed to efficiently dissipate heat from components in a circuit board. It is designed to be used in highly complex, high-density, space-constrained systems or circuits. The heat sink contains multiple rows of fins arranged in a cascade design, which allows for efficient heat transfer from the component to the atmosphere. It is made up of a metal body with aluminum fins, and can be easily mounted to the circuit board.
The ATS-21E-117-C1-R0 is designed to dissipate heat from components in a uniform manner. Unlike traditional heat sinks, the ATS-21E-117-C1-R0\'s cascade design ensures that heat is dissipated evenly throughout the component. This provides increased reliability and extended lifetime for the component, eliminating the risk of premature failure due to uneven heating. The heat sink\'s aluminum fins provide excellent thermal conductivity for improved heat dissipation.
The ATS-21E-117-C1-R0 is a reliable and efficient thermal management solution for complex systems. It is designed to be lightweight and compact, making it easy to install, while its superior thermal conductivity ensures efficient heat dissipation. With its innovative cascade design, it provides uniform heat distribution, eliminating the risk of component overheating.
The ATS-21E-117-C1-R0 is a powerful thermal management solution for complex systems. It is designed for efficient heat distribution, and its cascade design ensures the component works reliably and extends its lifetime. Its lightweight and compact design make it easy to install, and its efficient thermal conductivity ensures heat is effectively dissipated. It is a reliable and efficient solution for complex thermal management requirements.
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