| Allicdata Part #: | ATS-21E-136-C1-R0-ND |
| Manufacturer Part#: |
ATS-21E-136-C1-R0 |
| Price: | $ 6.36 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21E-136-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.72544 |
| 30 +: | $ 5.40750 |
| 50 +: | $ 5.08939 |
| 100 +: | $ 4.77131 |
| 250 +: | $ 4.45322 |
| 500 +: | $ 4.13513 |
| 1000 +: | $ 4.05561 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.17°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal – heatsink is a specialized form of heat exchanger or heat sink that is designed to efficiently dissipate the heat generated by electronic components. The ATS-21E-136-C1-R0 is a thermal – heatsink particularly suited for demanding applications. This article will review the features of the ATS-21E-136-C1-R0 and its potential application fields and the working principles.
The ATS-21E-136-C1-R0 is characterized by its high cooling performance and reliability, thanks to its special, carbon fibre reinforced plastic design. It offers superior thermal performance thanks to its unique elliptical fin design, which provides maximum surface area for efficient heat dissipation. The fin design also ensures an excellent distribution of air flow, eliminating any dead spots. Additionally, the ATS-21E-136-C1-R0 is designed to withstand high humidity levels and does not require the use of any additional sealants or mechanical fasteners.
In terms of its applications fields, the ATS-21E-136-C1-R0 is ideal for high-performance devices, such as processors, lasers, and drives. As it does not require additional sealants or mechanical fasteners, it is also well suited for use in harsh environments, such as in medical device manufacturing or in outdoor applications. Furthermore, the ATS-21E-136-C1-R0 is cost effective and easy to install, making it a great choice for low-to-medium volume applications.
The working principle of the ATS-21E-136-C1-R0 is based on convection cooling. The fin design creates a large surface area to allow air to flow over and through the fins. The air absorbs heat from the components, carrying it away from them and dissipating it into the surrounding environment. This allows the thermal energy to be removed from the system, keeping the components cool and ensuring their proper and reliable operation.
In conclusion, the ATS-21E-136-C1-R0 thermal – heatsink is a great choice for high-performance devices, especially those operating in harsh environments. Its high cooling performance and cost effective price make it a great option for low-to-medium volume applications. Thanks to its unique fin design, it ensures an excellent distribution of air flow and superior thermal performance, making it an ideal solution for keeping components at their optimal operating temperature.
The specific data is subject to PDF, and the above content is for reference