ATS-21E-143-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.33°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-21E-143-C2-R0 Application Field and Working Principle

Thermal - Heat Sinks are common used to absorb, disperse, transport and dissipate heat produced by modern electronics, such as CPUs, graphics chips, etc. The purpose of the heat sink is to draw heat away from the source, help keep it running at the desired temperature, and improve the overall electrical efficiency. The ATS-21E-143-C2-R0 is an advanced type of thermal - heat sink designed to provide improved efficiency and higher thermal performance in a wide variety of applications.The ATS-21E-143-C2-R0 is designed to be a medium size aluminum heat sink, with a total height of 143mm and a width of 30mm. Its compact design allows it to be a good fit for tight locations, making it suitable for both commercial and consumer applications. The ATS-21E-143-C2-R0 also features a higher thermal conductivity than similar heat sink designs, making it an efficient and reliable solution in many cases.The primary design feature of the ATS-21E-143-C2-R0 is its patented fin design. The fin design facilitates heat transfer between the base and the external environment. The fins act as miniature heat pipes, allowing the heat sink to quickly dissipate large amounts of heat quickly and efficiently. They also help the ATS-21E-143-C2-R0 to maintain a constant temperature, regardless of external conditions.The base of the ATS-21E-143-C2-R0 is made from an aluminum base and features an extrusion-copper heat spreader. The extrusion-copper heat spreader is designed to provide improved heat transfer capabilities, allowing the ATS-21E-143-C2-R0 to have increased thermal performance when compared to other heat sink solutions.When applying the ATS-21E-143-C2-R0, thermal paste is to be applied properly. Thermal paste helps to improve the thermal performance between the heat sink and the source, allowing it to transfer heat more efficiently. The thermal paste should be applied in a thin layer to the base of the ATS-21E-143-C2-R0, ensuring that enough is applied to cover the entire base.For the best results, the ATS-21E-143-C2-R0 should be placed in an environment that offers proper air circulation. Improper air circulation can cause the heat sink to become inefficient, leading to increased temperatures and possibly damaging the components. It is also important to note that the ATS-21E-143-C2-R0 should always be used with the appropriate fan or cooling system.The ATS-21E-143-C2-R0 is a reliable and efficient thermal solution for many applications. It offers increased thermal performance, a reliable base, and a fin design that helps it dissipate heat quickly. With the right thermal paste application and proper installation, it is possible to get the most out of the ATS-21E-143-C2-R0 and its thermal performance.

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