| Allicdata Part #: | ATS-21E-156-C3-R0-ND |
| Manufacturer Part#: |
ATS-21E-156-C3-R0 |
| Price: | $ 4.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21E-156-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.81717 |
| 30 +: | $ 3.60507 |
| 50 +: | $ 3.39293 |
| 100 +: | $ 3.18087 |
| 250 +: | $ 2.96881 |
| 500 +: | $ 2.75675 |
| 1000 +: | $ 2.70374 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat Sinks are the most common and effective method of dispersing heat away from sensitive components. ATS-21E-156-C3-R0 is one of the most commonly used thermal management solutions in the market and comes with both active and passive cooling solutions. This thermal solution has many applications, such as computer systems, solar panels, aerospace, military and automotive end-use applications.
The ATS-21E-156-C3-R0 is a thermal device designed to dissipate heat from electrical or electronic components within a given application. The unit is a passive system consisting of an assembled aluminum block with fins that are fabricated onto the unit so as to provide maximum surface area for the dissipation of heat. The fins are designed to increase the surface area of the device and thus improve the device’s ability to dispense heat faster. The fins can be used to direct airflow over the heat dissipating elements and provide greater exchange surface.
The ATS-21E-156-C3-R0 offers a wide range of cooling capabilities due to its versatile design. For example, it can effectively cool components and circuits with lower thermal loads, such as a processor core or graphic card. It can also be used to cool components that generate higher amounts of heat such as power semiconductors and high-power power supplies. As mentioned before, the fins of the device are designed to maximize air flow over the components being cooled and disperse the heat more effectively.
The working principle of the ATS-21E-156-C3-R0 is based on the use of convection as the main form of heat transfer. Convection occurs when air or liquid passes over a hot surface and absorbs the heat energy from it. This heat is then transferred away from the component into the surrounding environment. When the hot air or liquid is cooled, the heat energy is dissipated and the heat is removed from the component. This process is then repeated until the component reaches its desired temperature.
The ATS-21E-156-C3-R0 is designed so that air can easily flow through the fins and the heat can be dissipated away from the component. The fins on the device also help to improve the air flow and create more surface area for heat exchange. Additionally, the fins are also designed to create turbulent flow, which results in a better heat exchange rate.
The ATS-21E-156-C3-R0 is an efficient and effective thermal management solution for many applications. It is reliable, easy to install and cost effective for any application that requires effective thermal management. It is one of the most popular and widespread thermal solutions available in the market and has been used in a wide array of applications including computer systems, solar panels, aerospace, military, and automotive applications.
The specific data is subject to PDF, and the above content is for reference