| Allicdata Part #: | ATS35204-ND |
| Manufacturer Part#: |
ATS-21E-174-C2-R0 |
| Price: | $ 4.10 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X35MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21E-174-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.72330 |
| 10 +: | $ 3.62061 |
| 25 +: | $ 3.41939 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.02°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important part of any computer system. Heat sinks are used to transfer heat away from heat-generating components, such as processors, in order to prevent the system from overheating and causing damage. The ATS-21E-174-C2-R0 is a particularly good choice of heat sink for ensuring that your system remains at optimal temperatures.
The ATS-21E-174-C2-R0 is a heat sink designed for cooling high-power components. It is made from anodized aluminum and has a copper base for increased heat transfer efficiency. It features a low profile design which allows it to fit in small spaces, making it ideal for use in computers with limited space. The ATS-21E-174-C2-R0 also has a high thermal conductivity and is capable of dissipating up to 300W of power.
The working principle of the ATS-21E-174-C2-R0 is relatively simple. Heat is drawn away from the processor or other sources by the metal fins of the heat sink. As air passes over these fins, it absorbs the heat and removes it from the system. This heat is then dissipated to the surrounding environment, thus keeping the temperature of the processor within safe limits.
The ATS-21E-174-C2-R0 is suitable for a variety of applications, including gaming PCs, industrial PCs, servers, and embedded control applications. Its low profile design makes it particularly useful in tight spaces, and its high thermal conductivity makes it ideal for cooling high power components. Additionally, its copper base ensures efficient heat transfer and ensures that the heat is dissipated quickly and efficiently.
In conclusion, the ATS-21E-174-C2-R0 is a reliable and efficient heat sink that is suitable for cooling high-power components and can be used in many different applications. Its low profile design and copper base make it ideal for small spaces, and its excellent thermal conductivity ensures that the system remains at optimal temperatures.
The specific data is subject to PDF, and the above content is for reference