ATS-21E-181-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-21E-181-C3-R0-ND

Manufacturer Part#:

ATS-21E-181-C3-R0

Price: $ 3.91
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21E-181-C3-R0 datasheetATS-21E-181-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.55131
30 +: $ 3.35370
50 +: $ 3.15643
100 +: $ 2.95917
250 +: $ 2.76189
500 +: $ 2.56462
1000 +: $ 2.51530
Stock 1000Can Ship Immediately
$ 3.91
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.06°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks: ATS-21E-181-C3-R0 Application Field and Working Principle

Heat sinks are widely used in electronic applications to dissipate the heat generated by circuits over the lifetime of their operation. Heat sinks are key parts of any electronic circuit design and the process of selecting suitable thermal components plays a major role in achieving the maximum efficiency and economy of the circuit operation. Among the many different types of heat sinks available in the market, ATS-21E-181-C3-R0 heat sinks are some of the most efficient and cost effective options.

ATS-21E-181-C3-R0 heat sinks are designed for cooling applications in high-power electronics. The maximum thermal resistance of ATS-21E-181-C3-R0 heat sinks is 0.2 K/W which makes them an ideal choice for applications involving high current or power densities. The thermal conductivity of these heat sinks is also excellent, ensuring that the heat is quickly and effectively dissipated from the heat source. Furthermore, these heat sinks are constructed using aluminium profiles containing fins of anodised aluminium with a black finish

The main application field of ATS-21E-181-C3-R0 heat sinks is in cooling systems used in consumer electronics such as computers, phones, and other electronic equipment. The heat sinks are particularly useful in these applications because they are lightweight and highly efficient. In addition to cooling electronic devices, ATS-21E-181-C3-R0 heat sinks are also used for cooling industrial or automotive applications.

The working principle of ATS-21E-181-C3-R0 heat sinks is relatively simple. To understand this, one needs to have a basic understanding of thermodynamics. Heat is transferred from a high temperature source to a lower temperature sink by a process of convection. In this process, the heat generated by the circuit is first absorbed by the aluminum profile of the heat sink.

The heat is then transferred to the fins through conduction. These fins have a large surface area, which provides greater contact with the air, thereby increasing the rate of convection and the rate of heat dissipation. The air is then cooled by the fins, transferring the heat away from the circuit. In this way, the ATS-21E-181-C3-R0 heat sink is able to provide reliable and effective cooling for electronic circuits.

The ATS-21E-181-C3-R0 heat sink is a popular choice for many electronic cooling applications because of its combination of strong thermal performance, light weight, and cost-effectiveness. The heat sinks provide a reliable cooling solution for any high-power or high-current application. Furthermore, the versatility of these heat sinks makes them well suited for a variety of cooling applications, from consumer electronics to industry and automotive applications.

The specific data is subject to PDF, and the above content is for reference

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