ATS-21E-200-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.90°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-21E-200-C3-R0 is a high-performance heat sink solution designed to meet the needs of the most demanding thermal applications. This product is specifically designed for use in precision electronic components such as microprocessors, microprocessors clusters, power transistors, and infrared sensors. It has superior thermal properties that allow engineers to meet the thermal requirements of their applications without the need for an additional fan or cooling solution.

Benefits of ATS-21E-200-C3-R0 Heat Sink

The ATS-21E-200-C3-R0 heat sink offers several benefits compared to other thermal solutions such as fan cooling solutions. First of all, it is designed to dissipate heat quickly and efficiently, which helps reduce the system operating temperature. Second, it is extremely lightweight, making it ideal for many electronic applications that are placed in tight spaces. Finally, it is highly reliable and robust, making it a great choice for long-term applications.

ATS-21E-200-C3-R0 Application Field and Working Principle

The ATS-21E-200-C3-R0 is commonly used in a wide range of thermal applications. These include applications involving microprocessors, high-speed online gaming systems, data centers, laboratories, and more. The heat sink solution is highly reliable and works to dissipate heat produced by electronics quickly and effectively. The ATS-21E-200-C3-R0 works utilizing a two-stage design that incorporates a thermal heat sink and a fan into one unit. The thermal heat sink is designed to conduct and dissipate heat from a PCB to a surrounding air stream. The fan then moves the air stream away from the PCB, preventing any buildup of heat. This process effectively reduces the system operating temperature, allowing components to run for longer and operate more efficiently.

Features of ATS-21E-200-C3-R0 Heat Sink

The ATS-21E-200-C3-R0 heat sink is designed with several features that aid in its ability to quickly and efficiently dissipate heat. These include its high aspect ratio, which ensures efficient cooling performance; its lightweight and compact design, which makes it ideal for tight spaces; its metal fin design, which helps to reduce corrosion; and its low-noise operation, which ensures quiet operation. All these features ensure that this heat sink can provide users with reliable and robust thermal performance in the most demanding applications.

Conclusion

The ATS-21E-200-C3-R0 is a reliable and robust thermal solution designed for use in precision electronic components. It is designed to dissipate heat efficiently and quickly, allowing it to meet the thermal requirements of its applications without the need for an additional fan or cooling solution. Its lightweight and compact design also makes it ideal for tight spaces, and its high aspect ratio and metal fin design ensure efficient cooling performance and reduce corrosion. All these features make the ATS-21E-200-C3-R0 a great choice for any thermal application.

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