| Allicdata Part #: | ATS-21E-27-C1-R0-ND |
| Manufacturer Part#: |
ATS-21E-27-C1-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21E-27-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.23°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-21E-27-C1-R0 is a thermal - heat sink, which is designed to dissipate heat generated from electronic devices. It is typically used when power transistors, heatsinks or other devices operating at high temperatures require cooling. It performs an essential role in dissipating the heat produced by electronic circuits, helping to keep them running at optimum efficiency. The ATS-21E-27-C1-R0 uses convection, fins and a resistor to move the heat away from the hot component and disperse it into the environment. The application field of ATS-21E-27-C1-R0 is mainly for high power devices such as power transistors, heatsinks, and other electrical or electronic devices that work at high temperatures. It is often found in military and defense systems, medical equipment, and in industrial equipment like welding machines.The working principle of ATS-21E-27-C1-R0 is based on thermodynamics principles. Heat is conducted from the device with high temperature down to the cold fins of the heat sink, out into the environment or air. The fins help to maximize the heat transfer from the device and provide the most efficient way to dissipate the heat from it. The heat sink is designed with a resistor which is used to balance the heat transfer between the hot component to the environment.The ATS-21E-27-C1-R0 is a high quality PPA (Poly Phenylene Oxide) based heat sink designed with efficient cooling in mind. It has a high-frequency operation, low thermal resistance, and excellent durable. It is ideal for use in applications such as power semiconductors, high-power LED packages and power transistors. The ATS-21E-27-C1-R0 has a fast thermal response and reliable performance. It is also very simple to mount and assemble.In conclusion, the ATS-21E-27-C1-R0 is designed for applications in which effective thermal management is required. This heat sink offers thermal management through convection, fins, and resistors. It works on basic thermodynamics principles and is reliable and durable. The ATS-21E-27-C1-R0 can be used in a wide range of applications, and it is extremely easy to install and assemble.
The specific data is subject to PDF, and the above content is for reference