| Allicdata Part #: | ATS-21E-30-C3-R0-ND |
| Manufacturer Part#: |
ATS-21E-30-C3-R0 |
| Price: | $ 8.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21E-30-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 7.31934 |
| 30 +: | $ 6.88861 |
| 50 +: | $ 6.45813 |
| 100 +: | $ 6.02759 |
| 250 +: | $ 5.59705 |
| 500 +: | $ 5.48941 |
| 1000 +: | $ 5.38177 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks
ATS-21E-30-C3-R0 is a thermal management system, most commonly known as heat sink, used in a variety of industries, primarily electronics and the automotive industry. Heat sinks are essential pieces of equipment, designed to regulate temperatures, provide thermal insulation, and dissipate thermal energy.}
Heat sinks are often made from aluminum or copper, and are designed to absorb and dissipate heat in order to protect electronic components and materials. They commonly come in two forms; passive heat sinks, or fan-driven heat sinks. Fan-driven sinks are more effective in cooling, but they require an external fan mounted on the heatsink.
The ATS-21E-30-C3-R0 heat sink is a fan-driven device, designed to provide optimal cooling and thermal transfer to larger components, such as capacitors, transistors and relays. It is designed to work in temperatures up to 125 degrees Celsius, and can be used in a variety of applications, including LED lighting, automotive electronics and thermal management.
The ATS-21E-30-C3-R0 is comprised of a thermal conductive epoxy, designed to improve the efficiency of the device. The heat sink is designed to absorb, transfer, and dissipate heat away from the component or material it heats. This thermal transfer is improved by the epoxy used in the design, which helps to draw heat away from the component and spread it out, providing a more efficient transfer.
The device works by absorbing thermal energy and converting it to heat, using the heat sink material itself as a heat conductor. The device then dissipates this heat away from the component or material to the surrounding environment, making it a valuable asset in industries relying on consistent temperatures, such as data centers, automotive, and LED lighting.
The ATS-21E-30-C3-R0 is designed to provide efficient heat transfer and can be used in a variety of applications. Its large surface area ensures it can output more heat than a traditional passive heat sink, while its thermal epoxy ensures a more efficient transfer of thermal energy. This makes it an ideal choice for companies in need of reliable thermal insulation and temperature management.
The specific data is subject to PDF, and the above content is for reference