| Allicdata Part #: | ATS-21E-32-C2-R0-ND |
| Manufacturer Part#: |
ATS-21E-32-C2-R0 |
| Price: | $ 5.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21E-32-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.22837 |
| 30 +: | $ 4.93773 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATF-21E-32-C2-R0 is a thermal-heat sink used in many different applications. It can be used to transfer heat away from overheating components, helping to reduce their operational temperatures to within specifications. This type of thermal management system helps ensure that all of the components within a computer or other electrical device are maintained at an optimal temperature, helping to reduce the risk of component damage from excess heat.
The ATS-21E-32-C2-R0 is composed of two parts; a base plate and thermally conductive fins. The base plate acts as a foundation for the thermally conductive fins, which are a series of protruding metal strips. The base plate is made from a heat conductive material, such as aluminum or copper, and helps to dissipate the heat away from the source component by transferring it to the fins. The thermally conductive fins increase the surface area of the thermal-heat sink, giving it the ability to transfer more heat away from the source component.
In order to work, ATS-21E-32-C2-R0 needs to be attached to the source component, typically using thermal glue or thermal tape. This provides a secure connection between the thermal-heat sink and the source component, ensuring that the heat can be effectively transferred away from the source component. Once attached, the thermal-heat sink is connected to the system\'s fan or blower, allowing the heat to be carried away easily and dissipated throughout the system. The thermally conductive fins promote the effective dissipation of the heat, helping to reduce the risk of component damage due to uncontrolled increases in temperature.
The ATS-21E-32-C2-R0 is a useful, reliable, and cost-effective solution for any computer or other electrical device that suffers from extreme temperatures caused by the source components. By using a thermal-heat sink, the risk of component damage is reduced and the life-span of the device is increased. When properly installed, this type of thermal-heat sink can help maintain the optimal temperatures within the device, helping to avoid component damage and extend the life of the device.
The specific data is subject to PDF, and the above content is for reference