ATS-21E-67-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.39°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Overview of Thermal Heat Sinks

Thermal heat sinks are devices used to dissipate heat from an electronic device or another heated component. They are dissipation devices that aid in the cooling of the generated heat, allowing the temperature to remain at a safe operating level. Some of the most common designs of thermal heat sinks are the ATS-21E-67-C3-R0 mounted fin, plate and slot, to name a few.

ATS-21E-67-C3-R0 Heat Sink Application

The ATS-21E-67-C3-R0 is a specific heat sink device typically designed for personal computer CPUs and other electronic components. It is made of an aluminum body, aluminum alloy thermal resistance plates, and high thermal conductivity copper foil. This heat sink is designed to provide superior heat dissipation while taking up a relatively small package size and helping maintain stable operation of the electronic components.

ATS-21E-67-C3-R0 Heat Sink Working Principle

The ATS-21E-67-C3-R0 heat sink device consists of numerous aluminum and copper plates that are thermally conductive. These plates dissipate heat and transfer it away from the heated component. The aluminum body helps to absorb heat and the copper foil helps to spread it away from the component. As the heat dissipates, the aluminum and copper plates cool down and transfers the temperature away from the component. This helps to maintain a stable and safe operating temperature.

Conclusion

The ATS-21E-67-C3-R0 is a highly efficient heat sink device that is primarily used for PCs and other electronic components. It has a relatively small size and package, making it perfect for those situations when space is limited. Its aluminum body and copper foil ensure a high level of thermal resistance and dissipation, while the multiple aluminum and copper plates aid in cooling and transferring of the heat away from the electronic component.

The specific data is subject to PDF, and the above content is for reference