ATS-21F-08-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	14.61°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction:
The ATS-21F-08-C2-R0 is an advanced thermal management device for thermal and heat sink applications. Its unique design makes the ATS-21F-08-C2-R0 an ideal thermal management solution for a wide range of industrial, automotive, consumer, and military applications. This article will explore the ATS-21F-08-C2-R0 application fields and working principle. Application Field:
The ATS-21F-08-C2-R0 is used to protect components from heat damage in a wide range of applications. It is most often used to manage the heat produced by high horsepower communications and computing equipment. It is also used in home theaters, automobiles, industrial machinery, and medical equipment. The ATS-21F-08-C2-R0 is specifically designed to offer efficient and reliable thermal regulation in a variety of applications such as:

• Telecommunications infrastructure
• Personal computers
• Automotive electronics
• Industrial control systems
• Home entertainment systems
• Medical devices
• Military and aerospace applications

Working Principle:
The ATS-21F-08-C2-R0 is designed to dissipate heat through a composite structure that enables the system to simultaneously absorb and reflect thermal fluctuations. This composite structure consists of a core aluminum body, thermally conductive plates, and a fan-less cooling system.The core aluminum body of the ATS-21F-08-C2-R0 absorbs and reflects thermal energy through a series of slots that span from the top to the bottom of the device. These slots promote the efficient air flow of air molecules through the entire unit, allowing heat to be dissipated away from the components that need to be thermally regulated.The thermally conductive plates of the ATS-21F-08-C2-R0 are positioned between the core radiator and the components to absorb and dissipate heat. These plates are made out of a highly durable material and use their unique thermal conductivity to quickly dissipate heat away from the components.Finally, the fan-less cooling system of the ATS-21F-08-C2-R0 features a series of air intakes and vents located throughout the design. These air intakes allow fresh, cool air to be continuously pulled into the device to help dissipate heat away from the components. The vents then allow the hot, stale air to be released away from the system. Conclusion:
The ATS-21F-08-C2-R0 is a highly effective thermal management device designed for a variety of applications. Its unique structure enables the system to absorb and reflect thermal fluctuations, allowing it to dissipate heat away from critical components. It is most often used in telecommunications infrastructure, personal computers, automobiles, industrial control systems, home entertainment systems, medical devices, and military and aerospace applications.

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