| Allicdata Part #: | ATS-21F-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-21F-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks is a category of technologies which help to transfer the heat of a component into the surrounding air. The ATS-21F-10-C3-R0 is an example of Heat Sink technology that helps to transfer heat in small electronic components. The ATS-21F-10-C3-R0 transfers heat in a variety of ways, one of which is convection.
Convection is the natural process of transfer of heat from one location to another. This process works in order to evenly distribute the temperature in a system. Heat moves from the source to a cooler area. With convection-equipped ATS-21F-10-C3-R0, the airstream created helps to keep the temperature down. The sink also uses the air to transfer the heat away from the component. This helps keep the component from overheating.
The ATS-21F-10-C3-R0 is also equipped with sophisticated radiative cooling. This works in combination with convection to move the heat from the component to the outside air. The radiative cooling helps to reduce the temperature of the component to keep it within operating parameters. The radiative cooling also provides additional protection in the case of high ambient temperatures.
The ATS-21F-10-C3-R0 is an efficient Heat sink with several applications. It can be used in many different types of electronic devices such as laptops, mobile phones, tablets, and other small electronic components. The sink helps to keep the component cool by efficiently transferring the heat away from the component. This helps to prevent heat damage and ensure that the component operates properly and efficiently.
The ATS-21F-10-C3-R0 also provides a number of benefits as well. The heat transfer process of the sink is more efficient than other methods, meaning it requires less energy to operate. This helps to keep the component cooler for longer periods of time, improving the overall performance of the device. Additionally, the sink is relatively lightweight and easy to install.
The ATS-21F-10-C3-R0 is a reliable thermal management solution for components in a variety of applications. Its advanced combination of convection and radiative cooling allows it to provide effective heat transfer without putting a strain on the component. Additionally, its low cost and high efficiency make it an ideal choice for applications that require a reliable and effective heat transfer solution.
The specific data is subject to PDF, and the above content is for reference