ATS-21F-100-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.69°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal management has become an increasingly important factor in today’s electronics industry. As modern computing gains additional power, the challenge of effectively extracting heat from these systems has become ever more pressing. Heat sinks have been designed to address these issues, and one of the most advanced technology available on the market today is the ATS-21F-100-C1-R0. This heat sink is the result of collaborative design efforts by Advanced Thermal Solutions, Inc., a global leader in the thermal management industry.

Description

The ATS-21F-100-C1-R0 is a high performance thermal management solution. It is small in size, measuring only 3.94” x 2.76” x 0.31” (100mm x 70.1 mm x 8 mm). Despite its small size, the ATS- 21F-100-C1-R0 offers incredible performance; it is rated up to 200W of power dissipation. The ATS-21F-100-C1-R0 also features a high performance reglet fin design; this design ensures maximum heat displacement. The fin design also allows for the use of active cooling, such as a fan, to be used to provide additional cooling when needed.The ATS-21F-100-C1-R0 is constructed of anodized aluminum which helps provide its superior cooling performance. This material is also resistant to corrosion, making it a great choice for extended use in environments that may be exposed to moisture or other environmental elements. The ATS-21F-100-C1-R0 also comes equipped with a push pin mount which allows for easy installation and secure holding power.

Application fields and working principle

The ATS-21F-100-C1-R0 heat sink is designed for maximum performance and versatility. It is suitable for a wide range of applications, such as consumer electronics, commercial electronics, automotive electronics, telecom and networking equipment, industrial automation and robotics, and military and aerospace electronics.The ATS-21F-100-C1-R0 utilizes a combination of natural and forced convection to transfer and dissipate heat from the enclosed system. This is accomplished through the combination of the high performance reglet fin design and active cooling. The design of the reglet fin allows efficient air flow from the fan to be created over the surface of the fins, resulting in increased heat dissipation and lower system temperatures. The active cooling also helps to increase the circulation of air and reduce hot spots, leading to further reductions in operating temperatures.

Conclusion

The ATS-21F-100-C1-R0 is a valuable solution for the thermal management problems faced by today’s electronics industry. With its small size, high power rating, and excellent performance, the ATS-21F-100-C1-R0 heat sink is well suited for a huge variety of applications. Its reglet fin design allows for efficient cooling, while the active cooling option allows for additional performance when needed. The ATS-21F-100-C1-R0 is a great choice for when power and performance matters.

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