| Allicdata Part #: | ATS-21F-100-C3-R0-ND |
| Manufacturer Part#: |
ATS-21F-100-C3-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-100-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.22163 |
| 30 +: | $ 3.98727 |
| 50 +: | $ 3.75278 |
| 100 +: | $ 3.51823 |
| 250 +: | $ 3.28369 |
| 500 +: | $ 3.04914 |
| 1000 +: | $ 2.99050 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-21F-100-C3-R0 Heat Sink is a thermal device that works by dissipating heat generated by an electrical device such as a CPU, GPU or amplifier. The ATS-21F-100-C3-R0 Heat Sink is specifically designed to absorb and transfer heat away from the component to a location where it can dissipate safely.The ATS-21F-100-C3-R0 Heat Sink is made of a combination of metal base and fins designed to increase the surface area of the heat sink, allowing for more efficient heat transfer from the component to the atmosphere. The fin design used by the ATS-21F-100-C3-R0 Heat Sink enables heat to be absorbed by the base material and then radiate away from it. The fins also create an air flow through the heat sink which encourages air movement, thus aiding the heat transfer.The ATS-21F-100-C3-R0 Heat Sink is most commonly used in computers and computer accessories, such as in CPUs or GPUs. It can also be used to cool amplifiers and other electrical components that generate high levels of heat. By properly installing the ATS-21F-100-C3-R0 Heat Sink on an electronic device, you can reduce its temperature significantly and also increase its lifetime.The ATS-21F-100-C3-R0 Heat Sink works by conduction. Heat is absorbed by the thermal paste or pad applied between the component and the heat sink. The thermal paste or pad conducts the heat from the component to the base material of the heat sink. The heat is then transferred from the heat sink’s base material to the fins, and once the fins reach an equilibrium temperature they begin to dissipate the heat into the atmosphere.The ATS-21F-100-C3-R0 Heat Sink can be used with a fan to help transport heat away from the device, further improving the cooling performance. The fan can be installed directly onto the heat sink, or a clip-on fan can be used to attachment the fan to the heat sink. The use of a fan with the ATS-21F-100-C3-R0 Heat Sink helps to reduce the temperature at which heat is dissipated, helping to reduce the lifespan of electronic components.The ATS-21F-100-C3-R0 Heat Sink is designed to be simple to install and comes with instructions and installation diagrams. The ATS-21F-100-C3-R0 Heat Sink requires the use of thermal paste or pads to be applied between the component and the heat sink to ensure efficient transfer of heat.The ATS-21F-100-C3-R0 Heat Sink is an efficient way to reduce the temperature of electronic components that generate a lot of heat. By dissipating heat effectively, it can also increase the lifetime of these components and help to prevent damage or system failures. Furthermore, if a fan is used along with the ATS-21F-100-C3-R0 Heat Sink, the cooling performance is further improved and therefore the electronic device’s temperature is kept at a minimum.
The specific data is subject to PDF, and the above content is for reference