ATS-21F-111-C1-R1

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.362" (60.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.374" (9.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	26.72°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-21F-111-C1-R1 Thermal - Heat Sinks Application Field and Working Principle

ATS-21F-111-C1-R1 thermal - heat sinks are used in a variety of applications. They are most commonly found in industrial machines, computer equipment, electronics, audio/video systems, consumer products, medical devices, and telecommunications equipment.A heat sink is a device that transfers heat from one source to another. Its primary purpose is to remove excess heat generated by components in order to keep them functioning correctly. ATS-21F-111-C1-R1 thermal - heat sinks are designed to reduce temperature drastically and efficiently, making them invaluable in most any application.The main components of a ATS-21F-111-C1-R1 thermal - heat sink are a base, fins, and one or more heat pipes. The base is usually an aluminum alloy, but some models are made of copper or other metals. Fins are the conducting parts that absorb the heat and release it into the surrounding air. Heat pipes are special copper tubes filled with a liquid coolant that helps transfer heat away from the device to the heat sink.Heat transfer in ATS-21F-111-C1-R1 thermal - heat sinks works through a process called convection. Heat is transferred from the component to the fins of the heat sink. As the fins become hotter, hot air is released out of the heat sink, creating a draft of cooler air that enters the heat sink. The cool air absorbs heat from the fins and is released into the surrounding environment, thus cooling the device and allowing it to function optimally.In addition to convection, ATS-21F-111-C1-R1 thermal - heat sinks also use thermal radiation to dissipate heat. Radiation is the transfer of energy through space as electromagnetic waves. The hotter the fins become, the more energy they emit as electromagnetic radiation, which is radiated away into the ambient air, further cooling the device. Thermal design is an important aspect when it comes to the proper selection of a heat sink for a specific application. Thermal design considers the size of the heat sink as well as its material, the number of fins, and the total surface area in order to optimize heat dissipation. It is also important to consider the environment in which the heat sink will be used, as the thermal properties of the air can have a large effect on its performance.ATS-21F-111-C1-R1 thermal - heat sinks are invaluable for dissipating heat in industrial machines, telecommunications systems, consumer products, and many other applications. Their ability to efficiently transfer heat away from components allows them to be used in a broad range of applications, making them a vital component of any well-designed system.

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