| Allicdata Part #: | ATS-21F-111-C3-R1-ND |
| Manufacturer Part#: |
ATS-21F-111-C3-R1 |
| Price: | $ 6.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X40X9.5MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-111-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.69079 |
| 30 +: | $ 5.37474 |
| 50 +: | $ 5.05852 |
| 100 +: | $ 4.74239 |
| 250 +: | $ 4.42623 |
| 500 +: | $ 4.11007 |
| 1000 +: | $ 4.03103 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an integral part of many electronic systems, providing a way to dissipate the heat accumulated during the operational life cycle of the system. ATS-21F-111-C3-R1 is a thermal-heat sink with impressive performance and efficiency that can be used in a wide variety of applications.
The thermal-heat sink is produced using a combination of metallic powder, thermal compound and construction material. The powder is grooved, filled with a high flux thermal conductive compound and is then powder coated with aluminum oxide or aluminum metal coating to provide enhanced thermal conductivity. The construction material used in the thermal-heat sink also includes thermal protection and thread and fastener tolerance for increased safety.
This thermal-heat sink is capable of dissipating up to 250 to 320 watts. This means that it can be used in applications where high temperatures are present, such as gaming consoles, data centers, industrial automation systems, medical tools and more. Additionally, the thermal-heat sink has been designed to be resistant to extreme temperatures, dust, humidity and other environmental hazards that may make other thermal solutions ineffective.
ATS-21F-111-C3-R1 also has a very low impedance rating, making it ideal for fast heat dissipation over a wide temperature range. Its low thermal resistance ensures that heat is dissipated efficiently and quickly, which is particularly important in applications where fast cooling is necessary. It is also capable of providing thermal stability over a wide temperature range with a maximum resistance variation of 20mΩ.
In addition, the thermal-heat sink has been designed to be resistant to thermal shock. This makes it an ideal solution for applications such as power supplies, UPSs, LED lighting, sensors and more. The temperature variability means heat is dissipated quickly and the thermal shock resistance ensures that the device will remain effective well beyond the intended design cycle.
The thermal-heat sink also features a low resistance substrate, making it suitable for high-current applications. Furthermore, the low thermal resistance and thermal stability means the device can be used in applications requiring temperatures up to 200°C without any issues. This makes it a great choice for a variety of applications, including gaming consoles, data centers, industrial automation systems, medical tools and more.
Overall, ATS-21F-111-C3-R1 is a very versatile thermal-heat sink that can be used in a variety of applications. Its low impedance rating, low thermal resistance, thermal stability and thermal shock resistance make it an ideal solution for many electronic systems, providing efficient and fast cooling. Its low resistance substrate also makes it suitable for high-current applications.
The specific data is subject to PDF, and the above content is for reference