| Allicdata Part #: | ATS-21F-124-C1-R0-ND |
| Manufacturer Part#: |
ATS-21F-124-C1-R0 |
| Price: | $ 3.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-124-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.17394 |
| 30 +: | $ 3.08826 |
| 50 +: | $ 2.91677 |
| 100 +: | $ 2.74516 |
| 250 +: | $ 2.57363 |
| 500 +: | $ 2.48783 |
| 1000 +: | $ 2.23047 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.16°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction to ATS-21F-124-C1-R0
ATS-21F-124-C1-R0 is a type of thermal - heat sink manufactured by Advanced Thermal Solutions Inc. (ATS). It is a highly efficient aluminum passive cooling device for active airflow cooling. It is designed to cool PCB assemblies by directly dissipating the heat from IC packages to the surrounding air, thereby reducing the overall system temperature. The ATS-21F-124-C1-R0 has a finned base made of high-grade aluminum and comes with an optional air filter wrap, which helps to reduce dust collection in the air and ensure optimal cooling performance.
Application Field and Working Principle of ATS-21F-124-C1-R0
The ATS-21F-124-C1-R0 is designed to cool high-powered integrated circuits, such as CPUs, GPUs, and other microprocessors, in various applications. It can be used in consumer electronics, networking and communication equipment, automotive electronics, medical electronics, and other sensitive electronic equipment. The device can also be used in desktop computers, servers, embedded systems, and other computing systems.
The ATS-21F-124-C1-R0 works on the principle of convective heat transfer. The heat sink utilizes the concept of air-flow cooling, where the heat generated by the IC packages is directly dissipated into the surrounding air. The finned base is made of high-grade aluminum, which has a high thermal conductivity, and is surrounded by highly efficient cooling fins. The fins act as a heat conductor and absorb the heat generated by the IC packages and dissipate into the surrounding air, keeping the IC packages cool and enabling the system to operate at optimal temperatures.
The device also includes an optional air filter wrap, which helps to reduce dust collection in the air and increase cooling efficiency. The cost-effective design of the ATS-21F-124-C1-R0 also ensures that it offers exceptional performance and reliable operation in a wide range of temperatures.
Conclusion
The ATS-21F-124-C1-R0 is a highly efficient thermal - heat sink designed to cool high-powered integrated circuits. It is a cost-effective cooling solution that works on the principle of convective heat transfer and uses air-flow cooling to dissipate the heat generated by the IC packages. The finned base and optional air filter wrap help to increase the device\'s cooling efficiency and ensure optimal operating temperatures. The ATS-21F-124-C1-R0 is suitable for use in consumer electronics, automotive electronics, networking and communication equipment, medical electronics, embedded systems, desktop computers, and servers.
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