| Allicdata Part #: | ATS-21F-129-C3-R0-ND |
| Manufacturer Part#: |
ATS-21F-129-C3-R0 |
| Price: | $ 4.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-129-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.27959 |
| 30 +: | $ 4.04187 |
| 50 +: | $ 3.80419 |
| 100 +: | $ 3.56643 |
| 250 +: | $ 3.32867 |
| 500 +: | $ 3.09091 |
| 1000 +: | $ 3.03147 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.71°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-21F-129-C3-R0 thermal heat sinks are designed to dissipate heat and keep devices cool. Built from a variety of materials including aluminum and steel, they use heat conduction or convection to remove heat from the source. It is essential to choose the right type of heat sink in order to ensure the performance and reliability of any heat-generating electronic equipment.
An ATS-21F-129-C3-R0 thermal heat sink is a common choice among those who work with electronic equipment in industrial, automotive, and aerospace applications. Its innovative design enables air to flow through the heat sinks at a rate that is equal to that of air-cooled systems, but with less fan noise. Additionally, the heat sink has a low profile and compact footprint that makes it easy to fit into tight spaces while remaining light and efficient.
The working principle of ATS-21F-129-C3-R0 thermal heat sinks is simple. Heat generated by the device is transferred through the fins and dissipated into the atmosphere. This process-named conduction-is facilitated by a fan or a heatsink base that is designed specifically to draw in air and enhance the cooling process. Heat from the device is then absorbed by the surface of the heatsink and conducted to the fins where it is dissipated.
Additionally, ATS-21F-129-C3-R0 thermal heat sinks utilize convection cooling as well. In this method, air circulates around the heat sink body and heats up its fins. The warm air rises and is then pushed out by cooler air. This process ensures a more efficient cooling process while eliminating the need for a fan.
The ATS-21F-129-C3-R0 thermal heat sink is a great choice for a variety of applications. It is used in many industrial electronics, automotive, and aerospace environments due to its high performance and its ability to dissipate heat efficiently. Additionally, its small footprint and low profile make it a great fit for tight spaces.
The ATS-21F-129-C3-R0 thermal heat sink provides a balance between temperature and noise, making it ideal for a range of applications. It is reliable, durable, and easy to install, making it an all-around fantastic choice for those who are looking for an efficient cooling solution.
The specific data is subject to PDF, and the above content is for reference