ATS-21F-15-C3-R0

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Thermal management is an important aspect of many advanced engineering systems. Heat sinks are designed to dissipate heat from devices such as LED’s, circuit boards and other sensitive electronics. Heat sinks are used to transfer heat away from the device and into the surrounding environment. The ATS-21F-15-C3-R0 is a heat sink designed for the purpose of providing exceptional effective cooling performance. This article will focus on the ATS-21F-15-C3-R0 heat sink’s application field and working principle.

The ATS-21F-15-C3-R0 is a round aluminum heat sink with a flat circular base and a skived fin design. It has an overall diameter of 540mm and a fin height of 15mm. Its unique flat profile design has been optimized to optimize heat transfer to the surrounding air. The heat sink also features an open-air design, which helps to reduce heat build up and air stagnation, allowing for more efficient heat dissipation. This heat sink is ideal for Thermiaphic LED’s, Lighting, and Computer Boards and other high-performance applications.

The ATS-21F-15-C3-R0 is designed for maximum performance. The flat profile design allows for more efficient airflow and heat dissipation. The skived fins also provide an increase in heat transfer efficiency and reduce air stagnation. The overall design provides exceptional effective cooling performance, ensuring that your device remains cool and performs as expected.

The ATS-21F-15-C3-R0 heat sink works by dissipating heat from the device to the ambient air. Heat is generated by electrical components such as LED’s, circuit board components, and other active components. The heat is then transferred away from the device and into the surrounding air. This is accomplished in two ways. The first is through conduction, which is the transfer of heat from one object to another via direct contact or through a conduction interface. The second is through convection, which is the transfer of heat away from the device into the surrounding air. The design of the ATS-21F-15-C3-R0 helps to ensure an effective heat transfer rate to maximize thermal performance.

The ATS-21F-15-C3-R0 heat sink is designed for an optimal balance of thermal performance and reliability. It is designed for devices that require a moderate- to high-powered cooling solution. It is ideal for high power, high performance applications such as LED’s, Computer Boards, Lighting, and Thermiaphic systems. The heat sink also provides exceptional mechanical strength and impact resistance, making it an ideal choice for applications requiring a rugged design.

In conclusion, the ATS-21F-15-C3-R0 is a high performing heat sink that is designed for a wide variety of applications. It features a flat profile design, skived fins, and an open-air design, which helps to ensure an effective heat transfer rate. The heat sink also provides exceptional mechanical strength and impact resistance, making it an ideal choice for applications requiring a rugged design and maximum performance. The ATS-21F-15-C3-R0 is an excellent choice for thermal management applications.

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