
Allicdata Part #: | ATS-21F-159-C1-R0-ND |
Manufacturer Part#: |
ATS-21F-159-C1-R0 |
Price: | $ 3.56 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X10MM L-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.23379 |
30 +: | $ 3.14622 |
50 +: | $ 2.97133 |
100 +: | $ 2.79657 |
250 +: | $ 2.62181 |
500 +: | $ 2.53441 |
1000 +: | $ 2.27223 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 10.68°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
.The ATS-21F-159-C1-R0 is a highly efficient thermal-heat sink, or more specifically, a type of compact heat exchanger that works on the principle of natural convection cooling. It is designed to help systems dissipate heat generated by electronic equipment and other components without the need for a fan. This type of heat sink is especially useful in applications where fans would be difficult to clean or would cause noise.
The ATS-21F-159-C1-R0 is a particularly efficient form of thermal-heat sink thanks to its construction and design. It is composed of two layers of aluminum plates and filled with a heat absorbing compound that disperses heat quickly and efficiently. The two layers of aluminum plates are separated by an air gap which helps increase the surface area of the heat exchanger, thus increasing the cooling performance. Additionally, the air gap also helps increase the absorption of heat from the surrounding environment so that it can be better dissipated.
The ATS-21F-159-C1-R0 is widely used in cooling systems for computing and communications systems as well as for electronic components such as microprocessors, power supplies and memory modules. It is also often used in fan cabinets and other electronic devices that require efficient cooling. Due to its natural convection cooling characteristics, it can provide high reliability in situations where fans may be impractical to maintain.
The ATS-21F-159-C1-R0 works by allowing air to flow through the gap between the two layers of aluminum plates and absorb heat generated by the components. This heat is then conducted away from the components and released into the environment through the plates. The aluminum plates also help to further absorb heat from the environment so that it can be efficiently dissipated. As the heat is absorbed and dissipated in this manner, the temperature of the device and its components is kept at a safe level which helps to extend the life of the device.
The ATS-21F-159-C1-R0 is an efficient thermal-heat sink that can help keep devices and components cool in situations where fans are impractical or could create a lot of noise. It is a cost effective and reliable solution that can help extend the life of the device and its components. By dissipating heat quickly and efficiently, it helps to maintain the device\'s temperature at a safe level. This makes it a great choice for applications where efficient cooling is necessary.
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