| Allicdata Part #: | ATS-21F-164-C1-R0-ND |
| Manufacturer Part#: |
ATS-21F-164-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-164-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.39°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are designed to effectively dissipate heat from electronic components, such as the ATS-21F-164-C1-R0 thermal component. Heat sinks dissipate heat by transferring it away from the device and dissipating it into the surrounding environment through convection. The ATS-21F-164-C1-R0 is a high-speed thermal component with excellent cooling efficiency and low-resistance, allowing it to work effectively within a wide range of operating temperatures.
The ATS-21F-164-C1-R0 thermal component utilizes a self-contained air fin design for maximum heat dissipation and efficiency. The device is designed to quickly dissipate heat, utilizing a combination of a finned body and an air-cooled design. The finned design improves the rate of air flow over the surface of the component, allowing for greater heat exchange to take place.
The ATS-21F-164-C1-R0 thermal component is designed with a back-plate for effective heat transfer and a rigid body construction that helps to maintain the shape of the device. The back-plate also assists with the transfer of heat away from the component and reduces noise caused by the fans. The fins are evenly distributed across the entire surface area of the device, making it easier to dissipate heat quickly and evenly. The device can be securely mounted into a custom electrical enclosure to best suit the requirements of the application.
The ATS-21F-164-C1-R0 thermal component features low resistance to thermal strain and has been designed to function in high-stress environments. The device is designed to dissipate up to 200W of heat and is capable of a maximum operating temperature of 175 degrees. The thermal compound used is a specially formulated polymer-coated thermal adhesive that ensures maximum thermal transport between the device and its uneven surface. The device also has a built-in thermal shutdown feature which is designed to protect the device and its components from potential damage caused by excessive heat.
In addition to dissipating heat from the device, the ATS-21F-164-C1-R0 thermal component also features a temperature control system that can be used to regulate the operating temperature of the device. The system is designed to keep the thermal component within its recommended temperature range and can be used to adjust the temperature as needed. This ensures that the device will remain operational even in demanding environments, allowing for optimal operation.
The ATS-21F-164-C1-R0 thermal component is an excellent solution for applications that require efficient heat dissipation and control. The device is designed with an efficient air fin design and a temperature control system that allows for optimal operation in a wide range of environments. In addition, the device is designed to be securely mounted into an enclosure to ensure maximum stability and reliability. This makes the device an ideal choice for applications that require efficient and reliable cooling performance.
The specific data is subject to PDF, and the above content is for reference