ATS-21F-166-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS35393-ND

Manufacturer Part#:

ATS-21F-166-C2-R0

Price: $ 3.40
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X15MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21F-166-C2-R0 datasheetATS-21F-166-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.08700
10 +: $ 3.00762
25 +: $ 2.92648
50 +: $ 2.76381
100 +: $ 2.60127
250 +: $ 2.43868
500 +: $ 2.35738
1000 +: $ 2.11351
Stock 1000Can Ship Immediately
$ 3.4
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.18°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal control is an important factor in modern electronic design of all types. The ATS-21F-166-C2-R0 Heat Sink is a great solution to keep temperatures under control in operating and storage of both commercial and military electronics. This high-performance heat sink is easy to use and affordable. It has been designed to be used with a variety of different operating environments, so that electronic designs that need the most thermal control have the thermal solutions they need. The ATS-21F-166-C2-R0 heat sink has been developed to keep electronics safe, reliable and cool.

The ATS-21F-166-C2-R0 is a Peltier-style heat sink that is made to be used on standard-sized electronics packages and on some large form components. The Peltier technology utilizes thermoelectric modules to draw heat away from the component, assisting in the dissipation of heat to the surrounding environment. The heat is dissipated via free convection (not forced air cooling) so that the system remains quiet and vibration-less while running. The heat sink is predominantly constructed from copper, which has excellent thermal conductivity. A combination of anodized aluminum and copper gaskets provide the mounting and insulation to attach the sink to the component & keep it mounted securely.

The ATS-21F-166-C2-R0 features a low profile design with a base height of 11.5mm (.45 inch) and a maximum thermal resistance of 1.6oC/W, which is achieved by incorporating 30 bumps on the top of the sink that increase surface area, allowing for the quick and efficient transfer of heat. In addition, it has a unique patented design that places the cold side of the thermoelectric in the center area of the sink, which ensures maximum cooling efficiency. This sink is able to keep component temperatures between -25oC and +125oC in a worst-case ambient environment. It is also designed to be highly resistant to thermal shock and vibration.

The ATS-21F-166-C2-R0 is an effective solution for applications such as military and aerospace electronics, medical equipment, computer systems, audio components, automotive electronics, and more. On top of the excellent thermal performance, its ease of installation is an additional benefit. The heat sink is attached to the surface of the component with spring screws, making for an easy and repeatable mount. The heat sink is then securely held to the component via four insulation pads. As far as performance is concerned, the Peltier-style heat sink is able to provide the best thermal control in extremely high-temperature applications.

The ATS-21F-166-C2-R0 Peltier-style heat sink is an ideal choice for designers who want to keep their electronics running cool and reliably, without sacrificing performance. Thermal solutions from ATS provide an affordable and effective way to keep high-powered components at optimal temperatures, while still allowing for peak performance. Its low profile design and efficient cooling capabilities make it the perfect choice for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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