| Allicdata Part #: | ATS35397-ND |
| Manufacturer Part#: |
ATS-21F-17-C2-R0 |
| Price: | $ 4.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-17-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.13910 |
| 10 +: | $ 4.02507 |
| 25 +: | $ 3.80167 |
| 50 +: | $ 3.57802 |
| 100 +: | $ 3.35437 |
| 250 +: | $ 3.13075 |
| 500 +: | $ 2.90712 |
| 1000 +: | $ 2.85122 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important consideration in most electronic devices. Heat sinks are widely used in a variety of applications where heat needs to be removed from device components in order to ensure optimal performance and longevity of the device. The ATS-21F-17-C2-R0 is an innovative thermal management solution designed to provide an efficient and cost-effective way to remove heat from dynamically higher power components.
The ATS-21F-17-C2-R0 provides a much simpler and lighter-weight cooling solution compared to traditional air and liquid-cooled solutions. By using thermoelectric cooling technology and two Heat Sink Compound extruded aluminum AluFoil heat exchangers, the ATS-21F-17-C2-R0 is able to handle power densities of up to 1.65W/cm2. This makes it a particularly attractive thermal management solution for components and systems that are producing higher-power outputs.
Thermoelectric cooling is based on a phenomenon known as the Peltier effect, which occurs when electrical current is passed between two dissimilar metal plates. When current is passed one way, heat is removed from the hotter plate and transferred to the cooler plate. In the case of the ATS-21F-17-C2-R0, two heat sink compound extruded aluminum AluFoil heat exchangers are used to dissipate the heat from the hot side of the thermoelectric module, while the colder side is connected to a heatsink. The heat sink is then used to dissipate any remaining heat from the system.
The ATS-21F-17-C2-R0 is designed for use in a wide range of applications, from telecommunications to automotive to medical device applications. As well as providing a lightweight, low-cost solution to heat removal from components, the ATS-21F-17-C2-R0 is also highly reliable and is capable of maintaining temperatures up to 60°C for up to five hours under loading.
Overall, the ATS-21F-17-C2-R0 is an excellent choice for customers looking for an efficient and cost-effective thermal management solution for higher power components. Its ability to maintain temperatures up to 60°C for up to five hours under loading makes it an attractive solution for dynamic and long-term applications. Its lightweight design and simple installation also make it an ideal choice for a wide variety of applications.
The specific data is subject to PDF, and the above content is for reference