| Allicdata Part #: | ATS-21F-178-C1-R0-ND |
| Manufacturer Part#: |
ATS-21F-178-C1-R0 |
| Price: | $ 3.64 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-178-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.30498 |
| 30 +: | $ 3.21552 |
| 50 +: | $ 3.03698 |
| 100 +: | $ 2.85831 |
| 250 +: | $ 2.67964 |
| 500 +: | $ 2.59032 |
| 1000 +: | $ 2.32236 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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。Heat sinks are essential components of many electronic systems. They are designed to passively dissipate large amounts of thermal energy by transferring it away from sensitive components and to the surrounding environment. The ATS-21F-178-C1-R0 is a passive heat sink designed for applications where fast and reliable thermal management is required. In this article, we will discuss the application fields and working principle of this heat sink.
Application Fields of ATS-21F-178-C1-R0
The ATS-21F-178-C1-R0 is suitable for applications such as general-purpose computing, LED lighting, electric vehicle (EV) powertrain, motor drives, and other thermal management systems that require efficient and reliable thermal management. It is designed to endure temperature ranges from -40 to +85 degrees Celsius. Thanks to its finned design, the ATS-21F-178-C1-R0 is highly effective in dissipating large amounts of thermal energy, making it an ideal choice for electronics that need reliable thermal management.
Working Principle of ATS-21F-178-C1-R0
The ATS-21F-178-C1-R0 works on the principle of convective cooling. This means that heat is transferred away from the heat source by physical contact with a cooler surface. The ATS-21F-178-C1-R0 works by transferring its heat away from the source in the form of air flow, which is driven by differences in air temperature. The fins on the heat sink are designed to maximize the contact area between the fins and the surrounding air, allowing for greater heat transfer. This increases the rate of cooling, allowing it to transfer thermal energy away from sensitive components quickly and efficiently.
The ATS-21F-178-C1-R0 also utilizes a heat spreader. This device is used to increase the surface area of the heat sink. The heat spreader consists of a metal plate that is attached to the heat sink. The plate is designed to evenly spread the thermal load across the surface of the heat sink, increasing the overall cooling performance. This helps ensure that the heat sink is able to handle large thermal loads without compromising its efficiency.
Conclusion
The ATS-21F-178-C1-R0 is a high performance heat sink designed for applications where fast and reliable thermal management is required. Its finned design is highly effective in dissipating large amounts of thermal energy quickly and efficiently. It is suitable for applications such as general-purpose computing, LED lighting, electric vehicle (EV) powertrain, and motor drives. Finally, its use of a heat spreader increases its overall cooling performance, allowing it to handle larger thermal loads without sacrificing efficiency.
The specific data is subject to PDF, and the above content is for reference