| Allicdata Part #: | ATS-21F-18-C3-R0-ND |
| Manufacturer Part#: |
ATS-21F-18-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-18-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is critical for the efficient operation of electronic systems. Heat sinks are widely used in these systems to dissipate the heat from the core components. ATS-21F-18-C3-R0 is a heat sink designed for a specific application. In this article, we will explore the application fields and working principle of ATS-21F-18-C3-R0.
ATS-21F-18-C3-R0 is a low profile design designed for multiple applications. It offers excellent thermal transfer and low thermal resistance to ensure the efficient cooling of an electronic device. The heat sink is made from aluminum to provide high heat transfer efficiency and durability. It is designed to dissipate up to 18 watts of thermal energy and is compatible with up to 3 C series heatsink adapters. This makes it suitable for a wide variety of applications, including low-profile LED lighting, automotive electronics, and industrial applications.
The working principle of ATS-21F-18-C3-R0 is based on the concept of conduction. When electrical current passes through the heat sink, it creates thermal energy which is then dissipated through the metal surface of the heat sink. The shape of the heat sink is designed to optimize the thermal transfer and increase the surface area for greater heat dissipation. The fins also act as air champions which circulate air around the heat sink to maximize the efficiency of the cooling system.
The design of ATS-21F-18-C3-R0 is engineered to provide maximum cooling performance in a wide range of temperature platforms. The fins are designed to effectively dissipate the generated thermal energy over a wide range of temperature and ambient conditions. The heat sink also features an optimized airflow design for maximum cooling performance. The design also allows for easy installation and compatibility with multiple C series heatsink adapters.
Overall, ATS-21F-18-C3-R0 is a heat sink designed for multiple applications. It offers excellent thermal transfer and low thermal resistance for efficient cooling of an electronic device. The heat sink is made with aluminum for high heat transfer efficiency and durability. Its optimized design ensures maximum cooling performance in a wide range of temperature and ambient conditions. Additionally, the heat sink is compatible with up to 3 C series heatsink adapters, which makes it suitable for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference