| Allicdata Part #: | ATS-21F-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-21F-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an integral part of any computer system. As an essential component in controlling and dissipating heat generated by processor CPUs, graphics processing units (GPUs), memory chipsets, and other components within a computer system, they are commonly employed in situations where large amounts of energy must be moved between components, in order for those components to run efficiently and reliably. The ATS-21F-20-C3-R0 Heat Sink is one such component that is designed to provide superior thermal efficiency in a wide range of applications.
The ATS-21F-20-C3-R0 Heat Sink, designed by SMK Corporation, is a dual-fan heat sink with a potential cooling capacity of up to 96 watts. In addition to featuring a high-performance thermodynamic design, the device also utilizes SMK\'s innovative Variable Height™ anti-vibration fan-mounting technology, combining precision-engineered components, for extremely powerful, silent, and efficient cooling. The ATS-21F-20-C3-R0 is available with a variety of configurations, and can operate in a variety of conditions, such as low-pressure, high-pressure, and even extreme environmental conditions.
The ATS-21F-20-C3-R0 heat sink also features a unique lens-type design, which allows for a balanced distribution of the cooling airflow across the components. This is achieved by utilizing two opposite forces – the up and down forces from the spinning fans and the convection forces from the airflow – which guide the air flow across the entire surface area of the device. Thanks to this design, the ATS-21F-20-C3-R0 can provide an optimal thermal environment for components, enabling them to operate at peak performance.
When it comes to protection from extreme temperatures, the ATS-21F-20-C3-R0 is no slouch either. It is designed to be able to withstand temperatures ranging from -40°C to +85°C, with aluminum fins that are fabricated to create zero-tension in the device itself. This means that the aluminum is so strong and precise that the fans and fins remain in complete contact at all times, which helps to disperse heat quickly and protect the other components from excessive heat.
The ATS-21F-20-C3-R0 Heat Sink is a highly versatile component designed to meet the demands of the most demanding computer environments. Whether it is used for gaming PCs or for industrial equipment, the device provides superior thermal efficiency. And because it is able to withstand a wide range of temperatures and environmental conditions, the ATS-21F-20-C3-R0 can be used in virtually any application, ensuring that your computer system remains cool and efficient all of the time.
The specific data is subject to PDF, and the above content is for reference