| Allicdata Part #: | ATS-21F-29-C1-R0-ND |
| Manufacturer Part#: |
ATS-21F-29-C1-R0 |
| Price: | $ 6.83 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-29-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.14187 |
| 30 +: | $ 5.80083 |
| 50 +: | $ 5.45958 |
| 100 +: | $ 5.11831 |
| 250 +: | $ 4.77709 |
| 500 +: | $ 4.43586 |
| 1000 +: | $ 4.35056 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
The ATS-21F-29-C1-R0 is a thermal-heat sink and is used to transfer thermal energy from one physical point to another. It is primarily used to keep electronic components from over-heating. This thermal-heat-sink application can be applied in a variety of areas, including power management, power delivery, solar energy, and automotive applications.
The Thermal-Heat-Sink ATS-21F-29-C1-R0 features an effective thermal management with its non-conductive construction (materials that are not good conductors of electrical current) and superior design. It is designed to keep the temperature at any given point constant across the entire area of the thermal-heat-sink.
Application Field
The ATS-21F-29-C1-R0 is used in many areas as it can be employed to control temperature in a variety of applications. It is specifically used to prevent overheating in electronic devices, particularly when the device operating environment demands precise temperature control. It can also be used for elevating or lowering the temperature of a device in order to increase or decrease its performance.
The ATS-21F-29-C1-R0 is used in a range of applications such as power management, power delivery, solar energy, automotive and industrial applications, and other applications such as the thermal management of electronic devices.
Working Mechanism
The Thermal-Heat-Sink ATS-21F-29-C1-R0 is designed to provide a consistent temperature control across the entire area of the thermal-heat-sink. The mechanism works through a combination of two methods: heat conduction and heat dissipation.
Heat conduction is the transfer of thermal energy from one point to another through the application of a material that has a higher thermal conductivity (a measure of a material\'s ability to conduct thermal energy). The higher the thermal conductivity, the better the heat will be conducted and spread across the thermal-heat-sink.
Heat dissipation is the process of releasing or dispersing heat away. During this process, heat is dissipated away from the component being cooled, allowing for thermal management and preventing the component from overheating. This is achieved by the combination of a material\'s high thermal conductivity and specialized vents that remove the heat away from the component.
The Thermal-Heat-Sink ATS-21F-29-C1-R0 is installed with optimized fins that ensure efficient heat dissipation. These fins are designed using heat conduction and heat dissipation principles, allowing for a consistent temperature control across the entire area of the thermal-heat-sink.
The specific data is subject to PDF, and the above content is for reference