ATS-21F-29-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-21F-29-C3-R0-ND

Manufacturer Part#:

ATS-21F-29-C3-R0

Price: $ 7.62
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X20MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21F-29-C3-R0 datasheetATS-21F-29-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 6.86070
30 +: $ 6.45687
50 +: $ 6.05329
100 +: $ 5.64971
250 +: $ 5.24619
500 +: $ 5.14530
1000 +: $ 5.04441
Stock 1000Can Ship Immediately
$ 7.62
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.61°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction: ATS-21F-29-C3-R0 is one of the most popular and reliable thermal - heat sink products available in the market today. It is designed to dissipate heat from a range of devices, such as semiconductor and electronic assemblies, and is used in a variety of applications. This article will explore the ATS-21F-29-C3-R0 application field and working principle in detail.

The Application Field: ATS-21F-29-C3-R0 is a high-performance thermal - heat sink designed for use in a variety of applications, including industrial, military, aerospace, and electronics equipment. It is suitable for use in high-temperature environments, and can work effectively across a wide range of operating temperatures. Additionally, the ATS-21F-29-C3-R0 can be used for cooling devices such as processors, memory modules, and power converters.

The ATS-21F-29-C3-R0 is a highly reliable and efficient thermal - heat sink, and it is suitable for use in markets such as automotive, telecommunications, medical, consumer electronics, and industrial control systems. It is designed to dissipate heat in the most effective manner possible, making it an ideal choice for many applications including microcontrollers, motor control systems, and thermal energy storage. Additionally, the ATS-21F-29-C3-R0 is capable of dissipating high heat loads, and providing long-term reliability.

The ATS-21F-29-C3-R0 is also suitable for use in applications that require a low noise output. It is designed with a long-life and a low-noise design, making it a great choice for applications that require silent operation. Additionally, it is designed to dissipate heat quickly and efficiently, meaning it can be used effectively in applications that require rapid cooling.

Working Principle: The ATS-21F-29-C3-R0 is a thermal - heat sink designed to dissipate heat from a range of devices. Its working principle is based on the principle of convection. Heat is transferred from a device to the thermal - heat sink via a natural convection cycle created by the temperature differences between the two components. The thermal - heat sink then dissipates the heat into the atmosphere.

The ATS-21F-29-C3-R0 is designed to dissipate heat more effectively than other heat sinks. It is designed to use natural convection to dissipate the heat, which is more effective than the traditional method of forced-air cooling. Additionally, the ATS-21F-29-C3-R0 is designed to dissipate heat quickly and efficiently, making it a great choice for cooling applications that require rapid heat transfer.

The ATS-21F-29-C3-R0 also features a long-life design. Years of continuous operation in harsh environments can be achieved due to its efficient heat dissipation mechanism. Additionally, the ATS-21F-29-C3-R0 features high efficiency components which reduce heat build-up, thus increasing the reliability and life-span of the device.

Conclusion: The ATS-21F-29-C3-R0 is a high-performance thermal - heat sink designed for use in a variety of applications. It is designed with a long life and a low noise design, making it a great choice for applications that require silent operation. It is suitable for use in high-temperature environments, and can work effectively across a wide range of operating temperatures. Additionally, the ATS-21F-29-C3-R0 is designed to dissipate heat more effectively than other heat sinks, making it an ideal choice for many applications.

The specific data is subject to PDF, and the above content is for reference

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