| Allicdata Part #: | ATS-21F-33-C3-R0-ND |
| Manufacturer Part#: |
ATS-21F-33-C3-R0 |
| Price: | $ 5.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X17.78MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-33-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.23971 |
| 30 +: | $ 4.94865 |
| 50 +: | $ 4.65759 |
| 100 +: | $ 4.36647 |
| 250 +: | $ 4.07537 |
| 500 +: | $ 3.78427 |
| 1000 +: | $ 3.71150 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices designed to dissipate or radiate heat away from areas exposed to heat, such as thermal profiles associated with computer peripherals or other electronics. Heat sinks are essential components of many cooling systems that dissipate excess thermal energy generated by components such as CPUs or GPUs. The ATS-21F-33-C3-R0 is a heat sink with a standard size designed to fit in most enclosures.The ATS-21F-33-C3-R0 is a “Rugged” model that is designed to dissipate heat reliably in environments with high vibration levels. The operating temperature range for this heat sink is from -40°C to +125°C. It is available in five standard sizes, ranging from 90mm to 160mm in length. The ATS-21F-33-C3-R0 also features a large internal mass to ensure heat is effectively dissipated.The ATS-21F-33-C3-R0 utilizes a combination of two cooling elements in order to ensure efficient heat dissipation; namely the natural convection heatsink and the binding post and slug heat sink. Natural convection pumps air around the device, allowing heat to radiate away from the unit. The binding post and slug heat sink is a low-profile structure composed of a flat edge and raised posts to help air flow. This combination ensures that the ATS-21F-33-C3-R0 can effectively dissipate heat while maintaining a low profile.Beyond its efficiency in dissipating heat, the ATS-21F-33-C3-R0 also provides the user with flexible mounting options; this includes horizontal and vertical mountings, both of which are easily adjustable. It is also designed for use in a variety of configurations, including recessed and surface mountings.The ATS-21F-33-C3-R0 heat sink can be used in numerous applications that require efficient thermal dissipation. It can be used as a replacement or upgrade for aging processor coolers in personal computers, or can be added to industrial machinery or electronic components. If you are looking for a reliable and durable means of cooling for your next project, the ATS-21F-33-C3-R0 is an excellent option.The ATS-21F-33-C3-R0 has been specifically designed to meet the thermal requirements of a broad range of applications. By utilizing both natural convection and slug heat sinks the ATS-21F-33-C3-R0 is able to provide reliable and efficient thermal dissipation in areas exposed to high levels of vibration or extreme temperatures. This makes it an excellent choice for a wide variety of cooling applications and environments, making it an ideal thermal solution when looking to upgrade or replace aging computer processors. In addition, its flexible mounting options and durability make the ATS-21F-33-C3-R0 a great choice for industrial equipment, personal computers, and other electronics.
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