| Allicdata Part #: | ATS-21F-48-C1-R0-ND |
| Manufacturer Part#: |
ATS-21F-48-C1-R0 |
| Price: | $ 3.70 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-48-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.36420 |
| 30 +: | $ 3.27348 |
| 50 +: | $ 3.09154 |
| 100 +: | $ 2.90972 |
| 250 +: | $ 2.72785 |
| 500 +: | $ 2.63691 |
| 1000 +: | $ 2.36412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become one of the most important considerations when managing electronics components. Heat sinks, in particular, are the most common solution for cooling hot components. ATS-21F-48-C1-R0 is a high performance heat sink designed to provide optimal cooling and dissipate heat from sources such as processors, switches, memory chips, and other integrated circuits.
The ATS-21F-48-C1-R0 is a finned aluminum heat sink with a fin spacing of 0.25mm. This fin spacing helps to increase the air-flow rate and heat dissipation rate of the heat sink. Additionally, the fins are designed to optimize the thermal resistance of the heat sink, resulting in greater cooling efficiency. The optimized aluminum fins also allow for the use of specific compounds applied on top for additional cooling.
The ATS-21F-48-C1-R0 is designed to provide superior cooling performance even in high temperature environments. Its small form factor allows for easy integration into almost any thermal management system. Its compact design also enhances its heat dissipation properties compared to larger, more traditional heat sinks.
The ATS-21F-48-C1-R0 is designed to provide efficient cooling in applications that require high thermal performance. It is an ideal solution for controlling temperature in critical components such as processors and memory chips. The optimized fin design increases air-flow rate and heat dissipation rate, allowing for better heat control. The small form factor of the ATS-21F-48-C1-R0 also ensures easy integration into thermal management systems, allowing for complete control of temperature and airflow.
The ATS-21F-48-C1-R0 is able to dissipate heat from components that generate large amounts of heat. Its aluminum fins are optimized to maximize the heat transfer rate and improve overall thermal resistance. Additionally, the fin spacing of 0.25mm ensures increased air-flow rate and heat dissipation rate. The optimized design of the ATS-21F-48-C1-R0 also allows for the use of specific compounds applied on top for additional cooling.
The ATS-21F-48-C1-R0 is a highly efficient and reliable solution for dissipating heat from components that generate large amounts of heat. Its small form factor allows for easy integration into almost any thermal management system. The aluminum fins are optimized to maximize heat transfer rate and improve overall thermal resistance. Additionally, the fin spacing of 0.25mm ensures increased air-flow rate and heat dissipation rate. The optimized design of the ATS-21F-48-C1-R0 allows for the use of specific compounds applied on top for additional cooling. This, combined with its high-performance and reliability make the ATS-21F-48-C1-R0 an ideal solution for controlling temperature in critical components such as processors and memory chips.
The specific data is subject to PDF, and the above content is for reference