| Allicdata Part #: | ATS-21F-49-C3-R0-ND |
| Manufacturer Part#: |
ATS-21F-49-C3-R0 |
| Price: | $ 3.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-49-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16197 |
| 30 +: | $ 3.07671 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used to dissipate heat from a component, commonly semiconductor chips or transistors. They are designed to improve the efficiency of a system by providing a point of increased surface area, allowing thermal energy to be more effectively dissipated away from the system. The ATS-21F-49-C3-R0 is a thermal heat sink from the company AML Technologies that is designed to cool heat-generating components and ensure that temperature levels do not exceed the device’s specified maximum.
The ATS-21F-49-C3-R0 is designed for a variety of applications from consumer electronics to industrial and medical products. It is a very compact and lightweight design that is suitable for applications with limited space. The heat sink is made of aluminum alloy, making it highly durable. It also features a very efficient cooling system with a large surface area to dissipate thermal energy away quickly and efficiently.
The ATS-21F-49-C3-R0 is designed to be used in conjunction with an air-cooled or liquid-cooled heat spreader. It is connected to the heat spreader via a thermal interface material, which helps to ensure that heat energy is transferred with maximum efficiency and minimum resistance. This type of heat sink also features low air pressure drop for improved efficiency compared to other designs. Furthermore, its fin design ensures maximum surface area contact and optimized airflow, resulting in an efficient cooling system that can dissipate thermal energy away from the device quickly and effectively.
The working principle of the ATS-21F-49-C3-R0 is simple. Heat is generated by a component and must be dissipated away from the system in order for the system to remain stable and operate efficiently. The heat sink works by providing a point of increased surface area, allowing the thermal energy to be more effectively dissi
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