| Allicdata Part #: | ATS-21F-50-C1-R0-ND |
| Manufacturer Part#: |
ATS-21F-50-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-50-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are an integral part of any electronic system that needs to efficiently dissipate heat away from delicate components. ATS-21F-50-C1-R0 is one among such heat sinks that not only provides excellent heat dissipation performance but also looks good with its smooth brushed aluminum design.
This thermal heat sink is constructed from an aluminum fin array which is sandwiched between two aluminum plates. The fin array has fins of 0.4 mm in thickness and 50 mm in length and is made from high thermal conductivity anodized aluminum. The fins serve the purpose of dissipating an enormous amount of heat from the device into its surroundings. Since aluminum has a very low coefficient of thermal expansion, the thermal heat sink works effectively in temperatures ranging from -55 to +140 degrees Celsius.
This heat sink comes with four mounting holes for easy installation. You can also get two tear drop inlets at the top of the sink for airflow and mounting holes at the bottom that can be used to mount the heat sink on a flat surface. It has an attractive brushed aluminum exterior which makes it look aesthetically pleasing.
The ATS-21F-50-C1-R0 has a wide application field as it can be used in a variety of electronic systems, including computers, laptops, and even in mobile phones. It is mainly used to cool down the chipsets in the devices and keep them from overheating. It is also used in servers and other high-powered devices for more efficient heat dissipation. The aluminum construction of this heat sink makes it strong and durable and it can last for years without any damage.
The working principle of this thermal heat sink is quite simple. The heat is absorbed by the fin array and then dissipated away by convection into the surrounding air. As the ambient temperature rises, the heat absorbed by the heatsink increases, resulting in more effective cooling. This heat sink also has a large application area which ensures that the heat is dissipated over a larger area, thus reducing the chances of any components getting too hot.
ATS-21F-50-C1-R0 isa great thermal heat sink because of its excellent heat dissipation capabilities, excellent aesthetic appeal, and robust construction. This heat sink is an ideal choice for any electronic system that needs efficient heat dissipation. It is affordable and can easily be mounted onto any electronic system. With its superior heat dissipation performance and robust design, this thermal heat sink is undoubtedly one of the best in the market today.
The specific data is subject to PDF, and the above content is for reference