| Allicdata Part #: | ATS35469-ND |
| Manufacturer Part#: |
ATS-21F-60-C2-R0 |
| Price: | $ 4.63 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-60-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.20840 |
| 10 +: | $ 4.09437 |
| 25 +: | $ 3.86719 |
| 50 +: | $ 3.63964 |
| 100 +: | $ 3.41221 |
| 250 +: | $ 3.18473 |
| 500 +: | $ 2.95725 |
| 1000 +: | $ 2.90037 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-21F-60-C2-R0 engineering thermoelectric module is a Heat Sink device developed by Advanced Thermal Solutions (ATC) to meet the needs of cooling and heating applications in electronics components. It features a compact size, low weight and high efficiency performance. This product is designed for advanced thermal management in high power electronics systems.
The ATS-21F-60-C2-R0 Heat Sink device consists of two elements, a heat sink and a cooling element, with a temperature difference as the main energy source. The heat sink dissipates heat from the system while the cooling element removes the heat while cooling the system. The two elements are connected by a thermoelectric module which converts the temperature difference into electrical current for use in powering the system. The thermoelectric module is also capable of regulating temperature in response to feedback from external controllers. The device is designed to provide thermal management for a wide range of applications, such as cooling and heating electronics components in computers, communications systems, and consumer electronics.
The ATS-21F-60-C2-R0 Heat Sink device works by relying on the principle of the Peltier effect. The Peltier effect occurs when an electric current passes through two non-conductive materials with different levels of temperature. The area with the higher temperature becomes hotter while the area with the lower temperature will become cooler. This phenomenon is what makes Heat Sink devices an effective method of cooling or heating electronic components.
The thermoelectric module within the ATS-21F-60-C2-R0 Heat Sink device uses the Peltier effect to convert the temperature difference between the heat sink and the cooling element into electrical current to power the system. The device has a power rating of 30 Watts at a temperature difference of 10°C. It also features a unique design that allows it to be placed in tight spaces without compromising on performance.
In addition to the Peltier effect, the ATS-21F-60-C2-R0 Heat Sink device also utilises convection and radiation heat transfer methods. This allows the device to maintain an even temperature distribution and operating efficiency. The device features a built-in fan that improves overall cooling performance by expediting the exchange of heat between the heat sink and the cooling element.
The ATS-21F-60-C2-R0 Heat Sink device is designed for advanced thermal management of electronics components. It is ideal for applications in computers, communications systems, and consumer electronics due to its robust construction and high efficiency performance. The device is also light weight, compact, and capable of adapting to tight space requirements without sacrificing performance.
The specific data is subject to PDF, and the above content is for reference